loadpatents
name:-0.0028848648071289
name:-0.017431020736694
name:-0.0017039775848389
Inaba; Yoshiharu Patent Filings

Inaba; Yoshiharu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Inaba; Yoshiharu.The latest application filed is for "machine tool system".

Company Profile
1.20.8
  • Inaba; Yoshiharu - Yamanashi-ken JP
  • Inaba; Yoshiharu - Minamitsuru-gun JP
  • Inaba; Yoshiharu - Tachikawa JP
  • Inaba; Yoshiharu - Kawasaki JP
  • Inaba, Yoshiharu - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Machine tool system
Grant 10,507,558 - Inaba , et al. Dec
2019-12-17
Machine Tool System
App 20180250783 - Inaba; Yoshiharu ;   et al.
2018-09-06
Pb-free solder-connected structure
Grant 8,907,475 - Shimokawa , et al. December 9, 2
2014-12-09
Pb-FREE SOLDER-CONNECTED STRUCTURE
App 20130286621 - SHIMOKAWA; Hanae ;   et al.
2013-10-31
Pb-free solder-connected structure and electronic device
Grant 8,503,189 - Shimokawa , et al. August 6, 2
2013-08-06
Pb-free solder-connected structure and electronic device
App 20100214753 - SHIMOKAWA; Hanae ;   et al.
2010-08-26
Pb-free solder-connected structure and electronic device
Grant 7,709,746 - Shimokawa , et al. May 4, 2
2010-05-04
Pb-free solder-connected structure and electronic device
App 20060115994 - Shimokawa; Hanae ;   et al.
2006-06-01
Method of producing an electronic device having a PB free solder connection
Grant 7,013,564 - Shimokawa , et al. March 21, 2
2006-03-21
Pb-free solder-connected structure and electronic device
Grant 6,960,396 - Shimokawa , et al. November 1, 2
2005-11-01
Wire electric discharge machining apparatus
Grant 6,855,904 - Inaba , et al. February 15, 2
2005-02-15
Wire electric discharge machining apparatus
App 20040182825 - Inaba, Yoshiharu ;   et al.
2004-09-23
Pb-free solder-connected structure and electronic device
App 20020163085 - Shimokawa, Hanae ;   et al.
2002-11-07
Pb-free solder-connected structure and electronic device
App 20020019077 - Shimokawa, Hanae ;   et al.
2002-02-14
Technical field
App 20020009610 - Shimokawa, Hanae ;   et al.
2002-01-24
Two-platen mold-clamping apparatus
Grant 6,179,607 - Inaba , et al. January 30, 2
2001-01-30
Powder molding machine and method for filling molding materials into a die cavity thereof
Grant 5,647,410 - Nakagawa , et al. July 15, 1
1997-07-15
Injection molding machine having an automatic mold changer
Grant 5,249,947 - Inaba , et al. October 5, 1
1993-10-05
Molding condition recording apparatus for an injection molding machine
Grant 5,062,784 - Inaba , et al. November 5, 1
1991-11-05
Toggle type mold clamping apparatus in an electrically-operated injection molding machine
Grant 5,052,908 - Inaba , et al. October 1, 1
1991-10-01
Mold clamping force adjustment method
Grant 4,966,738 - Inaba , et al. October 30, 1
1990-10-30
Direct-pressure mold clamping mechanism
Grant 4,929,165 - Inaba , et al. May 29, 1
1990-05-29
Electrically operated injection molding machine
Grant 4,895,505 - Inaba , et al. January 23, 1
1990-01-23
Mold clamping apparatus in an injection molding machine
Grant 4,877,388 - Inaba , et al. * October 31, 1
1989-10-31
Mold opening/closing speed control device
Grant 4,696,632 - Inaba September 29, 1
1987-09-29
Injection molding apparatus
Grant 4,695,237 - Inaba September 22, 1
1987-09-22
Injection mechanism in injection molding apparatus
Grant 4,601,653 - Inaba July 22, 1
1986-07-22

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