loadpatents
Patent applications and USPTO patent grants for Inaba; Takehito.The latest application filed is for "light-repressible promoters".
Patent | Date |
---|---|
Circuit board Grant 7,253,363 - Iwasaki , et al. August 7, 2 | 2007-08-07 |
Light-repressible promoters App 20050166276 - Sasaki, Yukiko ;   et al. | 2005-07-28 |
Circuit board App 20050045371 - Iwasaki, Shota ;   et al. | 2005-03-03 |
Circuit board Grant 6,815,619 - Iwasaki , et al. November 9, 2 | 2004-11-09 |
Circuit board App 20020096357 - Iwasaki, Shota ;   et al. | 2002-07-25 |
Management Of A Lateral Deflection Amount Of A Metal Wire In A Semiconductor Device App 20010020734 - INABA, TAKEHITO | 2001-09-13 |
Semiconductor device, and semiconductor device with die pad and protruding chip lead frame and method of manufacturing the same Grant 6,265,760 - Inaba , et al. July 24, 2 | 2001-07-24 |
Semiconductor device with reduced thickness Grant 6,166,443 - Inaba , et al. December 26, 2 | 2000-12-26 |
Lead-on-chip type semiconductor device having thin plate and method for manufacturing the same Grant 6,093,958 - Inaba July 25, 2 | 2000-07-25 |
Plastic-encapsulated semiconductor device equipped with LOC package structure Grant 6,054,753 - Inaba April 25, 2 | 2000-04-25 |
Molding die for sealing semiconductor device with reduced resin burrs Grant 5,635,220 - Izumi , et al. June 3, 1 | 1997-06-03 |
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