Ina; Yasunobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ina; Yasunobu.The latest application filed is for "encapsulating sheet and electronic device".

Company Profile

0.7.11

Ina; Yasunobu - Ibaraki N/A JP
INA; Yasunobu - Osaka JP
Ina; Yasunobu - Ibaraki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Rubber-based pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet of the same Grant 8,604,124 - Yamaguchi , et al. December 10, 2	2013-12-10
Solid type rubber-based pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet thereof Grant 8,420,164 - Yamaguchi , et al. April 16, 2	2013-04-16
Encapsulating Sheet And Electronic Device App 20120296010 - SHIMIZU; Yuusaku ; et al.	2012-11-22
Crosslinked solid type pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet comprising the composition, and pressure-sensitive adhesive sheet for waterproofing/airproofing comprising the sheet Grant 7,677,011 - Yamaguchi , et al. March 16, 2	2010-03-16
Solid Type Rubber-based Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Sheet Thereof App 20100040777 - Yamaguchi; Tomoo ; et al.	2010-02-18
Method for producing masticated rubber Grant 7,629,435 - Yamaguchi , et al. December 8, 2	2009-12-08
Pressure-sensitive Adhesive Double-coated Sheet App 20090165920 - Yamaguchi; Tomoo ; et al.	2009-07-02
Crosslinked solid type pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet comprising the composition, and pressure-sensitive adhesive sheet for waterproofing/airproofing comprising the sheet App 20060165980 - Yamaguchi; Tomoo ; et al.	2006-07-27
Method for producing masticated rubber App 20050119452 - Yamaguchi, Tomoo ; et al.	2005-06-02
Solid type pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets using the same Grant 6,881,796 - Yamaguchi , et al. April 19, 2	2005-04-19
Method for producing a semiconductor-molding tablet, a semiconductor-molding tablet obtained thereby and a semiconductor device using the same App 20050023715 - Oono, Hirofumi ; et al.	2005-02-03
Crosslinked solid type pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet comprising the composition, and pressure-sensitive adhesive sheet for waterproofing/airproofing comprising the sheet App 20040258936 - Yamaguchi, Tomoo ; et al.	2004-12-23
Rubber-based pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet of the same App 20040260007 - Yamaguchi, Tomoo ; et al.	2004-12-23
Pressure-sensitive adhesive double-coated sheet App 20040241434 - Yamaguchi, Tomoo ; et al.	2004-12-02
Calender rollers and method for producing laminated sheet App 20010042452 - Hirose, Isao ; et al.	2001-11-22
Solid type pressure-sensitive adhesive composition and pressure-sensitive adhesive sheets using the same App 20010006723 - Yamaguchi, Tomoo ; et al.	2001-07-05

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