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Patent applications and USPTO patent grants for Imura; Ryoutarou.The latest application filed is for "conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device".
Patent | Date |
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Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device Grant 9,017,822 - Fukunaga , et al. April 28, 2 | 2015-04-28 |
Conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device Grant 8,754,510 - Minamio , et al. June 17, 2 | 2014-06-17 |
Conduction Path, Semiconductor Device Using The Same, And Method Of Manufacturing Conduction Path, And Semiconductor Device App 20120299166 - Minamio; Masanori ;   et al. | 2012-11-29 |
Lead Frame For Electronic Component And Method Of Manufacturing The Same App 20120133034 - Imura; Ryoutarou ;   et al. | 2012-05-31 |
Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device App 20070212478 - Fukunaga; Takahiro ;   et al. | 2007-09-13 |
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