IMOTO; Eiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for IMOTO; Eiichi.The latest application filed is for "pressure-sensitive adhesive sheet for surface protection".

Company Profile

3.7.27

IMOTO; Eiichi - Ibaraki-shi JP
IMOTO; Eiichi - Osaka JP
Imoto; Eiichi - Ibaraki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure-sensitive Adhesive Sheet For Surface Protection App 20220041900 - KUME; Keita ; et al.	2022-02-10
Sintered Body For Forming Rare-earth Magnet, And Rare-earth Sintered Magnet App 20210012934 - FUJIKAWA; Kenichi ; et al.	2021-01-14
Method for producing sintered body that forms rare-earth permanent magnet and has non-parallel easy magnetization axis orientation Grant 10,867,729 - Fujikawa , et al. December 15, 2	2020-12-15
Adhesive sheet Grant 10,392,533 - Imoto , et al. A	2019-08-27
Adhesive sheet Grant 10,000,668 - Imoto , et al. June 19, 2	2018-06-19
Method For Producing Sintered Body That Forms Rare-earth Permanent Magnet And Has Non-parallel Easy Magnetization Axis Orientation App 20180130581 - FUJIKAWA; Kenichi ; et al.	2018-05-10
Sintered Body For Forming Rare-earth Magnet, And Rare-earth Sintered Magnet App 20180108464 - FUJIKAWA; Kenichi ; et al.	2018-04-19
Permanent Magnet, Permanent Magnet Manufacturing Method, Rotating Electric Machine, And Rotating Electric Machine Manufacturing Method App 20170187258 - FUJIKAWA; Kenichi ; et al.	2017-06-29
Adhesive Sheet App 20160272851 - Imoto; Eiichi ; et al.	2016-09-22
Adhesive Sheet App 20160168425 - IMOTO; Eiichi ; et al.	2016-06-16
Production method for pressure-sensitive adhesive composition Grant 8,697,767 - Nakanishi , et al. April 15, 2	2014-04-15
Pressure-sensitive adhesive sheet for protecting semiconductor wafer Grant 8,546,958 - Habu , et al. October 1, 2	2013-10-01
W/o Emulsion, Foam, And Functional Foam App 20130216814 - Hirao; Akira ; et al.	2013-08-22
Pressure-sensitive Adhesive Composition And Pressure Sensitive Adhesive Tape App 20130084416 - NAKANISHI; Tadatoshi ; et al.	2013-04-04
Heat-adherent Film And Pressure-sensitive Adhesive Tape App 20130085250 - NAKANISHI; Tadatoshi ; et al.	2013-04-04
Production Method For Pressure-sensitive Adhesive Composition App 20130085202 - NAKANISHI; Tadatoshi ; et al.	2013-04-04
Production Method Of Cured Multilayer Sheet And Cured Multilayer Sheet App 20130034737 - Imoto; Eiichi ; et al.	2013-02-07
Ashesive Tape Or Sheet, And Base Material Therefor App 20120156483 - Shimazaki; Yuta ; et al.	2012-06-21
Viscoelastic Body And Method For Manufacturing The Same App 20120065350 - HABU; Takashi ; et al.	2012-03-15
Pressure-sensitive Adhesive Sheet For Protecting Semiconductor Wafer App 20120058319 - YAMAMOTO; Akiyoshi ; et al.	2012-03-08
Pressure-sensitive Adhesive Sheet For Protecting Semiconductor Wafer App 20120056338 - HABU; Takashi ; et al.	2012-03-08
Temporary Fixing Sheet App 20120059124 - SHIMAZAKI; Yuta ; et al.	2012-03-08
Composite Film And Method For Producing Same App 20120059125 - Imoto; Eiichi ; et al.	2012-03-08
Temporary Fixing Sheet For Manufacturing Process Of Electronic Parts App 20120058336 - SHIMOKAWA; Daisuke ; et al.	2012-03-08
Adhesive Sheet For Protecting Coating Film App 20110064900 - Uesugi; Masanori ; et al.	2011-03-17
Composite Film App 20110021705 - Imoto; Eiichi ; et al.	2011-01-27
Patch and patch preparation App 20090010995 - Hamada; Atsushi ; et al.	2009-01-08

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