| Patent | Date |
|---|
Method for producing an aqueous foam
Grant 10,759,921 - Cadra , et al. Sep | 2020-09-01 |
Method for adhering a first structure and a second structure
Grant 10,710,192 - Imbert , et al. | 2020-07-14 |
Method for assembling two substrates of different natures via a ductile intermediate layer
Grant 10,679,963 - Imbert , et al. | 2020-06-09 |
Method for direct bonding of III-V semiconductor substrates with a radical oxide layer
Grant 10,586,783 - Moriceau , et al. | 2020-03-10 |
Metal-metal direct bonding method
Grant 10,483,111 - Gondcharton , et al. Nov | 2019-11-19 |
Direct bonding method
Grant 10,403,597 - Gondcharton , et al. Sep | 2019-09-03 |
Method for assembling substrates by bonding indium phosphate surfaces
Grant 10,283,364 - Imbert , et al. | 2019-05-07 |
Direct bonding method
Grant 10,236,210 - Tauzin , et al. | 2019-03-19 |
Method For Producing An Aqueous Foam, Aqueous Foam Obtained By Such A Method And Uses Thereof
App 20180355139 - Cadra; Stephane ; et al. | 2018-12-13 |
Method For Assembling Substrates By Bonding Indium Phosphate Surfaces
App 20180330950 - IMBERT; Bruno ; et al. | 2018-11-15 |
Method for direct adhesion via low-roughness metal layers
Grant 10,115,698 - Gondcharton , et al. October 30, 2 | 2018-10-30 |
Method For Adhering A First Structure And A Second Structure
App 20180297143 - IMBERT; Bruno ; et al. | 2018-10-18 |
Direct Bonding Method
App 20180218999 - GONDCHARTON; Paul ; et al. | 2018-08-02 |
Method for obtaining a bonding surface for direct bonding
Grant 10,032,742 - Benaissa , et al. July 24, 2 | 2018-07-24 |
Method for implanting a piezoelectric material
Grant 9,991,439 - Deguet , et al. June 5, 2 | 2018-06-05 |
Direct Bonding Method
App 20180151436 - TAUZIN; Aurelie ; et al. | 2018-05-31 |
Process for producing a structure by assembling at least two elements by direct adhesive bonding
Grant 9,922,953 - Gondcharton , et al. March 20, 2 | 2018-03-20 |
Metal-metal Direct Bonding Method
App 20180019124 - GONDCHARTON; Paul ; et al. | 2018-01-18 |
Method For Direct Adhesion Via Low-roughness Metal Layers
App 20170236800 - GONDCHARTON; Paul ; et al. | 2017-08-17 |
Process for manufacturing a semiconductor structure with temporary bonding via metal layers
Grant 9,735,038 - Gondcharton , et al. August 15, 2 | 2017-08-15 |
Tungsten Layer Passivation Process And Direct Bonding Process
App 20170213807 - BENAISSA; Lamine ; et al. | 2017-07-27 |
Method For Manufacturing Substrates
App 20170133347 - MORICEAU; Hubert ; et al. | 2017-05-11 |
Process For Producing A Structure By Assembling At Least Two Elements By Direct Adhesive Bonding
App 20170025377 - GONDCHARTON; Paul ; et al. | 2017-01-26 |
Method for carrying out a conductive direct metal bonding
Grant 9,472,530 - Gondcharton , et al. October 18, 2 | 2016-10-18 |
Process For Manufacturing A Semiconductor Structure With Temporary Bonding Via Metal Layers
App 20160189995 - GONDCHARTON; Paul ; et al. | 2016-06-30 |
Method For Assembling Two Substrates Of Different Natures Via A Ductile Intermediate Layer
App 20160126215 - IMBERT; Bruno ; et al. | 2016-05-05 |
Method For Carrying Out A Conductive Direct Metal Bonding
App 20150380383 - GONDCHARTON; Paul ; et al. | 2015-12-31 |
Method For Obtaining A Bonding Surface For Direct Bonding
App 20150364442 - BENAISSA; Lamine ; et al. | 2015-12-17 |
Process for fabricating an acoustic wave resonator comprising a suspended membrane
Grant 8,715,517 - Imbert , et al. May 6, 2 | 2014-05-06 |
Method For Implanting A Piezoelectric Material
App 20130111719 - Deguet; Chrystel ; et al. | 2013-05-09 |
Process for Fabricating an Acoustic Wave Resonator Comprising a Suspended Membrane
App 20120145667 - IMBERT; Bruno ; et al. | 2012-06-14 |
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