Imanishi; Makoto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Imanishi; Makoto.The latest application filed is for "electronic component and resin packaging method for electronic component".

Company Profile

0.12.10

Imanishi; Makoto - Osaka N/A JP
Imanishi; Makoto - Neyagawa-shi JP
Imanishi; Makoto - Neyagawa JP
Imanishi; Makoto - Hirakata JP
Imanishi, Makoto - Hirakata-shi JP
Imanishi, Makoto - Osaka-fu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin sealing structure for electronic component and resin sealing method for electronic component Grant 8,358,018 - Imanishi , et al. January 22, 2	2013-01-22
Electronic Component And Resin Packaging Method For Electronic Component App 20090278265 - Imanishi; Makoto ; et al.	2009-11-12
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20080179378 - Imanishi; Makoto ; et al.	2008-07-31
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore Grant 7,387,229 - Imanishi , et al. June 17, 2	2008-06-17
Apparatus and method for forming bump Grant 7,350,684 - Narita , et al. April 1, 2	2008-04-01
Electronic component mounting apparatus and electronic component mounting method Grant 7,246,430 - Yonezawa , et al. July 24, 2	2007-07-24
Apparatus and method for forming bump App 20050191838 - Narita, Shoriki ; et al.	2005-09-01
Device and method for forming bump Grant 6,910,613 - Narita , et al. June 28, 2	2005-06-28
Electronic component mounting apparatus and electronic component mounting method App 20050071991 - Yonezawa, Takahiro ; et al.	2005-04-07
Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor Grant 6,787,391 - Imanishi , et al. September 7, 2	2004-09-07
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20040149803 - Imanishi, Makoto ; et al.	2004-08-05
Device and method for forming bump App 20040102030 - Narita, Shoriki ; et al.	2004-05-27
Working method for holding a work object by suction Grant 6,619,535 - Imanishi , et al. September 16, 2	2003-09-16
Bump bonding device and bump bonding method App 20020030087 - Imanishi, Makoto ; et al.	2002-03-14
Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer App 20020011479 - Narita, Shoriki ; et al.	2002-01-31
Bump bonding device and bump bonding method Grant 6,328,196 - Imanishi , et al. December 11, 2	2001-12-11
Bump bonding apparatus and method App 20010042772 - Narita, Shoriki ; et al.	2001-11-22
Bump bonding apparatus and method App 20010042771 - Narita, Shoriki ; et al.	2001-11-22
Bump bonding method and bump bonding apparatus Grant 6,017,812 - Yonezawa , et al. January 25, 2	2000-01-25
Bump levelling method and bump levelling apparatus Grant 5,899,140 - Yamamoto , et al. May 4, 1	1999-05-04
Linear actuating apparatus Grant 5,783,915 - Shida , et al. July 21, 1	1998-07-21

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