Imanari; Masaaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Imanari; Masaaki.The latest application filed is for "nickel plating solution".

Company Profile

0.2.12

Imanari; Masaaki - Misato-shi JP
Imanari; Masaaki - Misato-city JP
Imanari; Masaaki - Misato JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Nickel Plating Solution App 20180112319 - Imanari; Masaaki ; et al.	2018-04-26
Tin electroplating solution and tin electroplating method App 20100038254 - Takizawa; Yasushi ; et al.	2010-02-18
Electrolytic tin plating solution and electrolytic tin plating method App 20100000873 - Imanari; Masaaki ; et al.	2010-01-07
Tin electroplating solution and tin electroplating method App 20070068823 - Takizawa; Yasushi ; et al.	2007-03-29
Composite material with improved binding strength and method for forming the same App 20050164020 - Seita, Masaru ; et al.	2005-07-28
Method for forming resin composite material Grant 6,899,781 - Seita , et al. May 31, 2	2005-05-31
Formaldehyde-free electroless copper plating process and solution for use in the process App 20040253450 - Seita, Masaru ; et al.	2004-12-16
Resin composite material and method of forming the same App 20040170846 - Seita, Masaru ; et al.	2004-09-02
Direct patterning method App 20040101665 - Seita, Masaru ; et al.	2004-05-27
Method for manufacturing copper-resin composite material Grant 6,740,425 - Seita , et al. May 25, 2	2004-05-25
Composite material with improved binding strength and method for forming the same App 20040072015 - Seita, Masaru ; et al.	2004-04-15
Method for forming resin composite material App 20040001957 - Seita, Masaru ; et al.	2004-01-01
Method for manufacturing copper-resin composite material App 20030066754 - Seita, Masaru ; et al.	2003-04-10
Non-charging resin composite and method for manufacturing the same App 20030003307 - Tsuchida, Hideki ; et al.	2003-01-02

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