Imamura; Yoji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Imamura; Yoji.The latest application filed is for "solder alloy, solder paste, and electronic circuit board".
- Imamura; Yoji - Hyogo JP
- Imamura; Yoji - Kakogawa JP
- Imamura; Yoji - Kakogawa-shi JP
| Patent | Date |
|---|---|
| Solder alloy, solder paste, and electronic circuit board Grant 9,221,129 - Imamura , et al. December 29, 2 | 2015-12-29 |
| Solder alloy, solder paste, and electronic circuit board Grant 9,221,132 - Imamura , et al. December 29, 2 | 2015-12-29 |
| Solder Alloy, Solder Paste, And Electronic Circuit Board App 20150183062 - Imamura; Yoji ; et al. | 2015-07-02 |
| Solder Alloy, Solder Paste, And Electronic Circuit Board App 20150136461 - Imamura; Yoji ; et al. | 2015-05-21 |
| Low Silver Solder Alloy And Solder Paste Composition App 20120175020 - Imamura; Yoji ; et al. | 2012-07-12 |
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