loadpatents
name:-0.022577047348022
name:-0.011453151702881
name:-0.00070023536682129
Imamura; Kazuyuki Patent Filings

Imamura; Kazuyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Imamura; Kazuyuki.The latest application filed is for "multi-chip module".

Company Profile
0.12.11
  • Imamura; Kazuyuki - Yokohama N/A JP
  • Imamura; Kazuyuki - Kawasaki JP
  • Imamura; Kazuyuki - Kawasaki-shi JP
  • Imamura; Kazuyuki - Nagano JP
  • Imamura; Kazuyuki - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-chip module
Grant 8,446,020 - Koide , et al. May 21, 2
2013-05-21
Multi-chip Module
App 20110089579 - KOIDE; Masateru ;   et al.
2011-04-21
Semiconductor device and manufacturing method thereof
Grant 7,754,534 - Saito , et al. July 13, 2
2010-07-13
Semiconductor Device
App 20100155941 - Matsuki; Hirohisa ;   et al.
2010-06-24
Fibroblast Activator and Method of Activating Fibroblast, Collagen Synthesis Promoter and Method of Promoting Collagen Synthesis, and Skin Antiaging Agent and Method of Preventing Aging of Skin
App 20090297645 - Watanabe; Azuma ;   et al.
2009-12-03
Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit
Grant 7,483,818 - Amakai , et al. January 27, 2
2009-01-27
Semiconductor device and manufacturing method thereof
App 20080261336 - Saito; Nobukatsu ;   et al.
2008-10-23
Semiconductor device
Grant 7,268,433 - Matsuoka , et al. September 11, 2
2007-09-11
Semiconductor device
App 20070001317 - Matsuoka; Yoshihiro ;   et al.
2007-01-04
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
Grant 6,875,638 - Yoneda , et al. April 5, 2
2005-04-05
Semiconductor device and manufacturing method thereof
App 20040232549 - Saito, Nobukatsu ;   et al.
2004-11-25
Method for mounting electronic part and paste material
Grant 6,796,025 - Imamura , et al. September 28, 2
2004-09-28
Semiconductor device and manufacturing method thereof
Grant 6,794,273 - Saito , et al. September 21, 2
2004-09-21
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
App 20040053444 - Yoneda, Yoshiyuki ;   et al.
2004-03-18
Semiconductor device and manufacturing method thereof
App 20030219969 - Saito, Nobukatsu ;   et al.
2003-11-27
Flip-chip semiconductor device having an improved reliability
Grant 6,566,748 - Shimizu , et al. May 20, 2
2003-05-20
Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
App 20030082846 - Yoneda, Yoshiyuki ;   et al.
2003-05-01
Structural analysis program, a structural analysis method, a structural analysis apparatus, and a production process of a semiconductor integrated circuit
App 20030055612 - Amakai, Makoto ;   et al.
2003-03-20
Method for mounting electronic part and paste material
App 20020185309 - Imamura, Kazuyuki ;   et al.
2002-12-12
Semiconductor device having columnar electrode and method of manufacturing same
Grant 6,476,503 - Imamura , et al. November 5, 2
2002-11-05
Method for manufacturing semiconductor device with pad structure
Grant 6,232,147 - Matsuki , et al. May 15, 2
2001-05-15
Semiconductor device with pad structure
Grant 5,969,424 - Matsuki , et al. October 19, 1
1999-10-19

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