Imamura; Hisayuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Imamura; Hisayuki.The latest application filed is for "insulating substrate and semiconductor device using same".

Company Profile

4.14.13

Imamura; Hisayuki - Tokyo JP
Imamura; Hisayuki - Kitakyushu JP
Imamura; Hisayuki - Kitakyushu-shi JP
Imamura; Hisayuki - Saitama N/A JP
Imamura; Hisayuki - Fukaya JP
Imamura; Hisayuki - Saitama-ken JP
Imamura; Hisayuki - Aichi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Silicon nitride sintered substrate, silicon nitride sintered substrate sheet, circuit substrate, and production method for silicon nitride sintered substrate Grant 10,669,210 - Imamura , et al.	2020-06-02
Insulating substrate and semiconductor device using same Grant 10,559,509 - Hozoji , et al. Feb	2020-02-11
Insulating Substrate And Semiconductor Device Using Same App 20190221489 - HOZOJI; Hiroshi ; et al.	2019-07-18
Silicon Nitride Sintered Substrate, Silicon Nitride Sintered Substrate Sheet, Circuit Substrate, And Production Method For Silicon Nitride Sintered Substrate App 20190031566 - IMAMURA; Hisayuki ; et al.	2019-01-31
Ceramic circuit substrate and its production method Grant 10,057,992 - Teshima , et al. August 21, 2	2018-08-21
Brazing material, brazing material paste, ceramic circuit substrate, ceramic master circuit substrate, and power semiconductor module Grant 9,780,011 - Imamura , et al. October 3, 2	2017-10-03
Ceramic Circuit Substrate And Its Production Method App 20150216056 - Teshima; Hiroyuki ; et al.	2015-07-30
Silicon nitride substrate manufacturing method, silicon nitride substrate, silicon nitride circuit substrate, and semiconductor module Grant 8,858,865 - Kaga , et al. October 14, 2	2014-10-14
Brazing Material, Brazing Material Paste, Ceramic Circuit Substrate, Ceramic Master Circuit Substrate, And Power Semiconductor Module App 20140126155 - Imamura; Hisayuki ; et al.	2014-05-08
Circuit board and semiconductor module using this, production method for circuit board Grant 8,563,869 - Kaga , et al. October 22, 2	2013-10-22
Silicon Nitride Substrate Manufacturing Method, Silicon Nitride Substrate, Silicon Nitride Circuit Substrate, And Semiconductor Module App 20110272187 - Kaga; Youichirou ; et al.	2011-11-10
Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module Grant 7,915,533 - Kaga , et al. March 29, 2	2011-03-29
Circuit Board And Semiconductor Module Using This, Production Method For Circuit Board App 20090101392 - Kaga; Youichirou ; et al.	2009-04-23
Silicon Nitride Substrate, A Manufacturing Method Of The Silicon Nitride Substrate, A Silicon Nitride Wiring Board Using The Silicon Nitride Substrate, And Semiconductor Module App 20090039477 - Kaga; Youichirou ; et al.	2009-02-12
Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module App 20080315401 - Imamura; Hisayuki ; et al.	2008-12-25
Resin encapsulated semiconductor device and the production method Grant 7,372,132 - Suzuki , et al. May 13, 2	2008-05-13
Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate Grant 7,031,166 - Imamura , et al. April 18, 2	2006-04-18
Circuit board and semiconductor device using the same App 20050258550 - Morita, Toshiaki ; et al.	2005-11-24
Resin encapsulated semiconductor device and the production method App 20050221538 - Suzuki, Kazuhiro ; et al.	2005-10-06
Silicon nitride power, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate App 20050094381 - Imamura, Hisayuki ; et al.	2005-05-05
Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate Grant 6,846,765 - Imamura , et al. January 25, 2	2005-01-25
Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate App 20020164475 - Imamura, Hisayuki ; et al.	2002-11-07
Method of producing porous silicon nitride ceramics having high strength and low thermal conductivity Grant 5,968,426 - Hirao , et al. October 19, 1	1999-10-19

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