| Patent | Date |
|---|
Electronic device, method for manufacturing the electronic device, and electronic apparatus
Grant 10,283,434 - Sakai , et al. | 2019-05-07 |
Electronic component and electronic device
Grant 10,062,658 - Sakuyama , et al. August 28, 2 | 2018-08-28 |
Electronic component and electronic device
Grant 10,056,342 - Sakuyama , et al. August 21, 2 | 2018-08-21 |
Method of manufacturing an electronic device, and electronic device manufacturing apparatus
Grant 9,911,642 - Sakai , et al. March 6, 2 | 2018-03-06 |
Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
Grant 9,853,014 - Kikuchi , et al. December 26, 2 | 2017-12-26 |
Electronic apparatus and method for manufacturing electronic apparatus
Grant 9,754,904 - Morita , et al. September 5, 2 | 2017-09-05 |
Electronic Device, Method For Manufacturing The Electronic Device, And Electronic Apparatus
App 20170125359 - Sakai; Taiji ; et al. | 2017-05-04 |
Electronic Component, Electronic Apparatus, And Method Of Manufacturing Electronic Apparatus
App 20170098631 - Kikuchi; Ryo ; et al. | 2017-04-06 |
Electronic Apparatus And Method For Manufacturing Electronic Apparatus
App 20170047302 - Morita; Masaru ; et al. | 2017-02-16 |
Flux And Method For Manufacturing Semiconductor Device
App 20160354871 - SHIMIZU; KOZO ; et al. | 2016-12-08 |
Flux And Method Of Manufacturing Electronic Device
App 20160228999 - Shimizu; Kozo ; et al. | 2016-08-11 |
Optical device and optical module
Grant 9,235,001 - Sekiguchi , et al. January 12, 2 | 2016-01-12 |
Optical Device And Optical Module
App 20150323738 - Sekiguchi; Shigeaki ; et al. | 2015-11-12 |
Electronic Component And Electronic Device
App 20150311171 - SAKUYAMA; Seiki ; et al. | 2015-10-29 |
Semiconductor device and power source device
Grant 9,082,756 - Shimizu , et al. July 14, 2 | 2015-07-14 |
Electronic device having electrodes bonded with each other
Grant 8,922,027 - Sakai , et al. December 30, 2 | 2014-12-30 |
Electronic Device, Method Of Manufacturing, And Electronic Device Manufacturing Apparatus
App 20140342504 - SAKAI; Taiji ; et al. | 2014-11-20 |
Semiconductor Device And Power Source Device
App 20140203444 - SHIMIZU; KOZO ; et al. | 2014-07-24 |
Semiconductor device, manufacturing method of semiconductor device, and power source device
Grant 8,728,867 - Shimizu , et al. May 20, 2 | 2014-05-20 |
Semiconductor device, method for manufacturing the same, and power supply unit
Grant 8,674,520 - Imaizumi , et al. March 18, 2 | 2014-03-18 |
Solder, soldering method, and semiconductor device
Grant 8,673,762 - Akamatsu , et al. March 18, 2 | 2014-03-18 |
Electronic Device, Method Of Manufacturing, And Electronic Device Manufacturing Apparatus
App 20130187293 - SAKAI; Taiji ; et al. | 2013-07-25 |
Semiconductor device and method for producing the same, and power supply
Grant 8,492,784 - Okamoto , et al. July 23, 2 | 2013-07-23 |
Electronic Component And Electronic Device
App 20130164956 - SAKUYAMA; Seiki ; et al. | 2013-06-27 |
Method of manufacturing semiconductor device
Grant 8,409,931 - Sakai , et al. April 2, 2 | 2013-04-02 |
Method Of Manufacturing Semiconductor Device
App 20120244665 - SAKAI; Taiji ; et al. | 2012-09-27 |
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20120217626 - SAKAI; Taiji ; et al. | 2012-08-30 |
Semiconductor Device, Method Of Manufacturing Semiconductor Device And Electronic Circuit
App 20120211762 - IMADA; Tadahiro ; et al. | 2012-08-23 |
Semiconductor Device, Method For Manufacturing The Same, And Power Supply Unit
App 20120211899 - IMAIZUMI; Nobuhiro ; et al. | 2012-08-23 |
Semiconductor Device, Manufacturing Method Of Semiconductor Device, And Power Source Device
App 20120211901 - SHIMIZU; Kozo ; et al. | 2012-08-23 |
Semiconductor Device And Method For Manufacturing Semiconductor Device
App 20120211764 - OKAMOTO; Keishiro ; et al. | 2012-08-23 |
Semiconductor Device And Method For Producing The Same, And Power Supply
App 20120199991 - OKAMOTO; Keishiro ; et al. | 2012-08-09 |
Solder, Soldering Method, And Semiconductor Device
App 20120193800 - Akamatsu; Toshiya ; et al. | 2012-08-02 |
Multi-layer display element and manufacturing method for the same
Grant 7,852,439 - Yamaguchi , et al. December 14, 2 | 2010-12-14 |
Method for processing a base that includes connecting a first base to a second base
Grant 7,816,180 - Mizukoshi , et al. October 19, 2 | 2010-10-19 |
Method for processing a base that includes connecting a first base to a second base with an insulating film
Grant 7,811,835 - Mizukoshi , et al. October 12, 2 | 2010-10-12 |
Multi-layer Display Element And Manufacturing Method For The Same
App 20100097550 - Yamaguchi; Hisashi ; et al. | 2010-04-22 |
Method For Processing A Base
App 20090181497 - Mizukoshi; Masataka ; et al. | 2009-07-16 |
Method For Processing A Base
App 20090176331 - MIZUKOSHI; Masataka ; et al. | 2009-07-09 |
Method for processing a base that includes connecting a first base to a second base with an insulating film
Grant 7,514,295 - Mizukoshi , et al. April 7, 2 | 2009-04-07 |
Method of connecting base materials
Grant 7,402,461 - Mizukoshi , et al. July 22, 2 | 2008-07-22 |
Method for processing base
App 20060027936 - Mizukoshi; Masataka ; et al. | 2006-02-09 |
Method for processing base
App 20060030071 - Mizukoshi; Masataka ; et al. | 2006-02-09 |
Method of connecting base materials
App 20050227474 - Mizukoshi, Masataka ; et al. | 2005-10-13 |
Semiconductor device and method of making the same
App 20050110169 - Yagi, Tomohisa ; et al. | 2005-05-26 |
Electrode-to-electrode bond structure
Grant 6,873,056 - Sakuyama , et al. March 29, 2 | 2005-03-29 |
Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening
Grant 6,869,822 - Yagi , et al. March 22, 2 | 2005-03-22 |
Adhesive composition
Grant 6,790,881 - Date , et al. September 14, 2 | 2004-09-14 |
Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
App 20040106232 - Sakuyama, Seiki ; et al. | 2004-06-03 |
Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
Grant 6,670,264 - Sakuyama , et al. December 30, 2 | 2003-12-30 |
Adhesive, bonding method and assembly of mounting substrate
Grant 6,576,081 - Date , et al. June 10, 2 | 2003-06-10 |
Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby
App 20030080397 - Sakuyama, Seiki ; et al. | 2003-05-01 |
Adhesive composition
App 20030069333 - Date, Hiroaki ; et al. | 2003-04-10 |
Semiconductor device and method of making the same
App 20030049888 - Yagi, Tomohisa ; et al. | 2003-03-13 |
Adhesive, Bonding Method And Assembly Of Mounting Substrate
App 20020084019 - DATE, HIROAKI ; et al. | 2002-07-04 |
Overcurrent breaking circuit
Grant 5,926,010 - Hosokawa , et al. July 20, 1 | 1999-07-20 |
Vehicle load control system
Grant 5,859,845 - Oniishi , et al. January 12, 1 | 1999-01-12 |
Load control system for vehicle
Grant 5,845,221 - Hosokawa , et al. December 1, 1 | 1998-12-01 |
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