IMAI; Kazunari

Patent Applications and Registrations

Patent applications and USPTO patent grants for IMAI; Kazunari.The latest application filed is for "bending method and bending system".

Company Profile

0.10.11

IMAI; Kazunari - Kanagawa JP
Imai; Kazunari - Joetsu N/A JP
Imai; Kazunari - Joetsu-shi JP
Imai; Kazunari - Niigata JP
Imai; Kazunari - Nagano JP
IMAI, KAZUNARI - NAGANO-SHI JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bending Method And Bending System App 20220288663 - NAGAHASHI; Hirohito ; et al.	2022-09-15
Prepreg manufacturing device Grant 8,789,571 - Machii , et al. July 29, 2	2014-07-29
Prepreg Manufacturing Device App 20100236722 - Machii; Akihiko ; et al.	2010-09-23
Method of manufacturing lens sheet App 20060208374 - Shimotsuma; Hiroyuki ; et al.	2006-09-21
Sheet working method, sheet working system, and various devices related to such system Grant 7,040,129 - Koyama , et al. May 9, 2	2006-05-09
Bending method and bending device Grant 7,007,530 - Koyama , et al. March 7, 2	2006-03-07
Bending method and device therefor Grant 6,941,784 - Koyama , et al. September 13, 2	2005-09-13
Bending method and single elongation value specifying device of bending apparatus Grant 6,832,526 - Koyama , et al. December 21, 2	2004-12-21
Sheet thickness detecting method and device therefor in bending machine, reference inter-blade distance detecting method and device therefor, and bending method and bending device Grant 6,796,155 - Koyama , et al. September 28, 2	2004-09-28
Substrate for mounting electronic parts thereon and method of manufacturing same Grant 6,730,859 - Muramatsu , et al. May 4, 2	2004-05-04
Semiconductor Device Having External Connecting Terminals And Process For Manufacturing The Device App 20030107131 - HIGASHI, MITSUTOSHI ; et al.	2003-06-12
Bending method and single elongation value specifying device of bending apparatus App 20030105548 - Koyama, Junichi ; et al.	2003-06-05
Sheet working method, sheet working system, and various devices related to such system App 20030015011 - Koyama, Junichi ; et al.	2003-01-23
Bending method and device therefor App 20030010078 - Koyama, Junichi ; et al.	2003-01-16
Bending method and bending device App 20030000269 - Koyama, Junichi ; et al.	2003-01-02
Multilayered wiring board, a production process for, and semiconductor device using, the same Grant 6,410,858 - Sasaki , et al. June 25, 2	2002-06-25
Multilayered Wiring Board, A Production Process For, And Semiconductor Device Using, The Same App 20020043399 - Sasaki, Masayuki ; et al.	2002-04-18
Semiconductor device having external connecting terminals and process for manufacturing the device App 20010028108 - Higashi, Mitsutoshi ; et al.	2001-10-11
Semiconductor device and process for producing the same Grant 6,297,553 - Horiuchi , et al. October 2, 2	2001-10-02
Substrate for mounting electronic parts thereon and method of manufacturing same App 20010023781 - Muramatsu, Shigetsugu ; et al.	2001-09-27

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