| Patent | Date |
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Semiconductor package including composite molding structure
Grant 11,373,933 - Lee , et al. June 28, 2 | 2022-06-28 |
Method And Device For Temperature Detection And Thermal Management Based On Power Measurement
App 20220136909 - Kim; Byungsu ; et al. | 2022-05-05 |
Semiconductor module including heat dissipation layer
Grant 11,251,102 - Im , et al. February 15, 2 | 2022-02-15 |
Semiconductor Module Including Heat Dissipation Layer
App 20210296198 - IM; YUNHYEOK ; et al. | 2021-09-23 |
Semiconductor Package Including Composite Molding Structure
App 20210272880 - LEE; HEESEOK ; et al. | 2021-09-02 |
Semiconductor package
Grant 11,037,913 - Im , et al. June 15, 2 | 2021-06-15 |
Semiconductor Package And Semiconductor Device Including The Same
App 20200381400 - LEE; HEESEOK ; et al. | 2020-12-03 |
Semiconductor Package
App 20200328187 - CHO; Youngsang ; et al. | 2020-10-15 |
Semiconductor Package
App 20200251455 - Kind Code | 2020-08-06 |
Semiconductor package
Grant 10,665,574 - Im , et al. | 2020-05-26 |
Semiconductor Package
App 20190229100 - IM; YUNHYEOK ; et al. | 2019-07-25 |
Semiconductor Packages And Methods Of Fabricating The Same
App 20180269126 - Im; Yunhyeok ; et al. | 2018-09-20 |
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
Grant 9,978,661 - Im , et al. May 22, 2 | 2018-05-22 |
Package-on-package device
Grant 9,583,430 - Park , et al. February 28, 2 | 2017-02-28 |
Semiconductor Packages And Methods Of Fabricating The Same
App 20170047264 - IM; YUNHYEOK ; et al. | 2017-02-16 |
Semiconductor packages including heat exhaust part
Grant 9,391,009 - Jang , et al. July 12, 2 | 2016-07-12 |
Semiconductor package and method for manufacturing the same
Grant 9,356,002 - Im May 31, 2 | 2016-05-31 |
Package-on-package devices, methods of fabricating the same, and semiconductor packages
Grant 9,324,696 - Choi , et al. April 26, 2 | 2016-04-26 |
Semiconductor Package And Method For Manufacturing The Same
App 20150357269 - IM; Yunhyeok | 2015-12-10 |
Semiconductor package having a heat slug and a spacer
Grant 9,190,338 - Park , et al. November 17, 2 | 2015-11-17 |
Semiconductor Package And Method Of Fabricating The Same
App 20150171028 - JO; CHAJEA ; et al. | 2015-06-18 |
Semiconductor package device
Grant 9,029,998 - Jang , et al. May 12, 2 | 2015-05-12 |
Semiconductor packages
Grant 9,024,434 - Im , et al. May 5, 2 | 2015-05-05 |
Package-on-package Device
App 20150115467 - PARK; Kyol ; et al. | 2015-04-30 |
Semiconductor packages including heat diffusion vias and interconnection vias
Grant 9,013,031 - Im , et al. April 21, 2 | 2015-04-21 |
Package-on-package Devices, Methods Of Fabricating The Same, And Semiconductor Packages
App 20150061095 - Choi; Mi-Na ; et al. | 2015-03-05 |
Semiconductor Packages Including Heat Diffusion Vias And Interconnection Vias
App 20140367860 - IM; YUNHYEOK ; et al. | 2014-12-18 |
Semiconductor Package Having A System-in-package Structure
App 20140353813 - Park; Kyol ; et al. | 2014-12-04 |
Semiconductor Package Device
App 20140339708 - JANG; Eon Soo ; et al. | 2014-11-20 |
Mobile Device And Data Communication Method Of Semiconductor Integrated Circuit Of Mobile Device
App 20140136827 - CHO; EUNSEOK ; et al. | 2014-05-15 |
Semiconductor Packages
App 20120280382 - IM; Yunhyeok ; et al. | 2012-11-08 |
Semiconductor Package And Method Of Manufacturing The Same
App 20120175782 - Im; Yunhyeok ; et al. | 2012-07-12 |
Semiconductor Package And Method Of Manufacturing The Same
App 20120139097 - JIN; JEONGGI ; et al. | 2012-06-07 |
Semiconductor Package And Method Of Forming The Same
App 20120119346 - IM; YUNHYEOK ; et al. | 2012-05-17 |
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