Im; Sung Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Im; Sung Jun.The latest application filed is for "method of manufacturing semiconductor light emitting device package".

Company Profile

0.11.15

Im; Sung Jun - Yongin-si KR
IM; Sung Jun - Suwon-si KR
Im; Sung-jun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light emitting device packages and methods of forming the same Grant 9,705,041 - Im , et al. July 11, 2	2017-07-11
Electronic device package and package substrate for the same Grant 9,391,250 - Im , et al. July 12, 2	2016-07-12
Method Of Manufacturing Semiconductor Light Emitting Device Package App 20160126432 - KWON; Yong Min ; et al.	2016-05-05
Method of manufacturing chip-stacked semiconductor package Grant 9,136,260 - Ahn , et al. September 15, 2	2015-09-15
Light Emitting Device Package App 20150243846 - KWON; Yong-min ; et al.	2015-08-27
Electronic device package and packaging substrate for the same Grant 9,059,149 - Kwon , et al. June 16, 2	2015-06-16
Method Of Manufacturing Semiconductor Light Emitting Device Package App 20140377894 - KWON; Yong Min ; et al.	2014-12-25
Method Of Manufacturing Semiconductor Light Emitting Device Package App 20140339581 - KWON; Yong Min ; et al.	2014-11-20
Electronic Device Package And Package Substrate For The Same App 20140306261 - IM; Sung Jun ; et al.	2014-10-16
Light Emitting Device Packages And Methods Of Forming The Same App 20140246648 - Im; Sung Jun ; et al.	2014-09-04
Electronic Device Package And Packaging Substrate For The Same App 20140203451 - KWON; Yong Min ; et al.	2014-07-24
Method Of Manufacturing Chip-stacked Semiconductor Package App 20140154839 - Ahn; Jung-seok ; et al.	2014-06-05
Method of manufacturing chip-stacked semiconductor package Grant 8,637,350 - Ahn , et al. January 28, 2	2014-01-28
Stacked chips in a semiconductor package Grant 8,637,969 - Lee , et al. January 28, 2	2014-01-28
Semiconductor Package and Method of Manufacturing the Same App 20130264706 - Lee; Teak-hoon ; et al.	2013-10-10
Method of fabricating stacked chips in a semiconductor package Grant 8,455,301 - Lee , et al. June 4, 2	2013-06-04
Method Of Manufacturing Chip-stacked Semiconductor Package App 20120282735 - Ahn; Jung-seok ; et al.	2012-11-08
Semiconductor Package and Method of Manufacturing the Same App 20120088332 - Lee; Teak-hoon ; et al.	2012-04-12
Semiconductor device including thermally dissipating dummy pads Grant 7,800,138 - Baek , et al. September 21, 2	2010-09-21
Semiconductor Device, Semiconductor Package, Stacked Module, Card, System And Method Of Manufacturing The Semiconductor Device App 20090057880 - BAEK; Joong-Hyun ; et al.	2009-03-05

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