| Patent | Date |
|---|
Power Module And Related Methods
App 20220208654 - BAEK; Jonghwan ; et al. | 2022-06-30 |
Dual Cool Power Module With Stress Buffer Layer
App 20220199602 - BAEK; Jonghwan ; et al. | 2022-06-23 |
Clips For Semiconductor Package And Related Methods
App 20220173022 - YOO; Inpil ; et al. | 2022-06-02 |
Direct-cooling For Semiconductor Device Modules
App 20220157688 - EOM; JooYang ; et al. | 2022-05-19 |
Integrated Circuit Direct Cooling Systems And Related Methods
App 20220093487 - IM; Seungwon ; et al. | 2022-03-24 |
Clips for semiconductor package and related methods
Grant 11,264,311 - Yoo , et al. March 1, 2 | 2022-03-01 |
Semiconductor package having a spacer with a junction cooling pipe
Grant 11,201,105 - Im , et al. December 14, 2 | 2021-12-14 |
Heat transfer for power modules
Grant 11,145,571 - Yoo , et al. October 12, 2 | 2021-10-12 |
Power Module Package And Method Of Manufacturing The Same Related Application
App 20210265175 - LEE; Keunhyuk ; et al. | 2021-08-26 |
Semiconductor Package And Related Methods
App 20210265318 - IM; Seungwon ; et al. | 2021-08-26 |
Semiconductor die package including a one-body clip
Grant 11,101,198 - Im , et al. August 24, 2 | 2021-08-24 |
Integration Of Semiconductor Device Assemblies With Thermal Dissipation Mechanisms
App 20210249332 - IM; Seungwon ; et al. | 2021-08-12 |
Semiconductor Packages Using Package In Package Systems And Related Methods
App 20210242167 - YOO; Inpil ; et al. | 2021-08-05 |
Semiconductor package and related methods
Grant 11,037,907 - Im , et al. June 15, 2 | 2021-06-15 |
Stray inductance reduction in packaged semiconductor devices
Grant 11,031,379 - Im , et al. June 8, 2 | 2021-06-08 |
Package Including Multiple Semiconductor Devices
App 20210151367 - Teysseyre; Jerome ; et al. | 2021-05-20 |
Semiconductor Device Package Assemblies And Methods Of Manufacture
App 20210143107 - IM; Seungwon ; et al. | 2021-05-13 |
Power module package
Grant 11,004,698 - Lee , et al. May 11, 2 | 2021-05-11 |
Clips For Semiconductor Package And Related Methods
App 20210111104 - YOO; Inpil ; et al. | 2021-04-15 |
Stray Inductance Reduction In Packaged Semiconductor Devices
App 20210066256 - IM; Seungwon ; et al. | 2021-03-04 |
Semiconductor Device Package Assemblies And Methods Of Manufacture
App 20210066174 - IM; Seungwon ; et al. | 2021-03-04 |
Package including multiple semiconductor devices
Grant 10,910,297 - Teysseyre , et al. February 2, 2 | 2021-02-02 |
Heat Transfer For Power Modules
App 20200388557 - YOO; Inpil ; et al. | 2020-12-10 |
Semiconductor Die Package Including A One-body Clip
App 20200194346 - IM; Seungwon ; et al. | 2020-06-18 |
Integrated Circuit Direct Cooling Systems And Related Methods
App 20200185305 - IM; Seungwon ; et al. | 2020-06-11 |
Semiconductor package having junction cooling pipes embedded in substrates
Grant 10,607,919 - Im , et al. | 2020-03-31 |
Semiconductor die package and manufacturing method
Grant 10,586,754 - Im , et al. | 2020-03-10 |
Semiconductor Package And Related Methods
App 20190348399 - IM; Seungwon ; et al. | 2019-11-14 |
Package Including Multiple Semiconductor Devices
App 20190287886 - TEYSSEYRE; Jerome ; et al. | 2019-09-19 |
Semiconductor package and related methods
Grant 10,403,601 - Im , et al. Sep | 2019-09-03 |
Package including multiple semiconductor devices
Grant 10,319,670 - Teysseyre , et al. | 2019-06-11 |
Package Including Multiple Semiconductor Devices
App 20190122970 - TEYSSEYRE; Jerome ; et al. | 2019-04-25 |
Integrated Circuit Direct Cooling Systems And Related Methods
App 20180315681 - IM; Seungwon ; et al. | 2018-11-01 |
Stray inductance reduction in packaged semiconductor devices and modules
Grant 10,090,279 - Im , et al. October 2, 2 | 2018-10-02 |
Stray Inductance Reduction In Packaged Semiconductor Devices And Modules
App 20180254262 - IM; Seungwon ; et al. | 2018-09-06 |
Semiconductor Die Package And Manufacturing Method
App 20180122725 - IM; Seungwon ; et al. | 2018-05-03 |
Semiconductor Package And Related Methods
App 20170365583 - IM; Seungwon ; et al. | 2017-12-21 |
Power module having stacked flip-chip and method for fabricating the power module
Grant 9,130,065 - Im , et al. September 8, 2 | 2015-09-08 |
Power Module Package And Method Of Manufacturing The Same
App 20150103498 - Lee; Keunhyuk ; et al. | 2015-04-16 |
Complex Semiconductor Packages and Methods of Fabricating the Same
App 20140327144 - Yang; Gwi-gyeon ; et al. | 2014-11-06 |
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