IM; Hyun Gu

Patent Applications and Registrations

Patent applications and USPTO patent grants for IM; Hyun Gu.The latest application filed is for "circuit board".

Company Profile

3.8.11

IM; Hyun Gu - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit Board App 20220132653 - CHOI; Byeong Kyun ; et al.	2022-04-28
Printed Circuit Board App 20220061147 - KIM; Yong Suk ; et al.	2022-02-24
Circuit board Grant 10,932,362 - Lee , et al. February 23, 2	2021-02-23
Circuit Board App 20200315004 - LEE; Jong Sik ; et al.	2020-10-01
Light-emitting device having a plurality of support layers and light-emitting device package including the same Grant 10,468,554 - Han , et al. No	2019-11-05
Inorganic filler, epoxy resin composition including the same and light emitting element including insulating layer using the composition Grant 10,392,499 - Yun , et al. A	2019-08-27
Light-emitting Device And Light-emitting Device Package Including The Same App 20180190867 - HAN; Young Ju ; et al.	2018-07-05
Printed circuit board and light-emitting device including same Grant 9,923,123 - Kim , et al. March 20, 2	2018-03-20
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,902,841 - Ju , et al. February 27, 2	2018-02-27
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170233554 - JU; Sang A ; et al.	2017-08-17
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,670,340 - Ju , et al. June 6, 2	2017-06-06
Inorganic Filler, Epoxy Resin Composition Including The Same And Light Emitting Element Including Insulating Layer Using The Composition App 20170130033 - YUN; Sung Jin ; et al.	2017-05-11
Printed Circuit Board And Light-emitting Device Including Same App 20170069798 - KIM; Jeong Han ; et al.	2017-03-09
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20170058107 - Ju; Sang A ; et al.	2017-03-02
Light Emitting Element Module App 20160381782 - YOON; Sang In ; et al.	2016-12-29
Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Grant 9,505,914 - Ju , et al. November 29, 2	2016-11-29
Inorganic Filler, Resin Composition Comprising The Same And Heat Radiation Substrate Using The Same App 20160222195 - JU; Sang A ; et al.	2016-08-04
Printed circuit board and light emitting device Grant 9,241,399 - Yoon , et al. January 19, 2	2016-01-19
Printed Circuit Board And Light Emitting Device App 20150181691 - YOON; Sang In ; et al.	2015-06-25

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