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Patent applications and USPTO patent grants for Im; Hyoung Min.The latest application filed is for "semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semicond".
Patent | Date |
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Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages Grant 11,018,094 - Lee , et al. May 25, 2 | 2021-05-25 |
Semiconductor Packages Configured For Measuring Contact Resistances And Methods Of Obtaining Contact Resistances Of The Semicond App 20200191860 - LEE; Ki Yong ;   et al. | 2020-06-18 |
Semiconductor package including planar stacked semiconductor chips Grant 9,875,990 - Choi , et al. January 23, 2 | 2018-01-23 |
Semiconductor Package Including Planar Stacked Semiconductor Chips App 20170040291 - CHOI; Hyung Ju ;   et al. | 2017-02-09 |
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