loadpatents
Patent applications and USPTO patent grants for Ikura; Kazuyuki.The latest application filed is for "manufacturing apparatus and method for optical waveguide structure".
Patent | Date |
---|---|
Component mounting apparatus Grant 8,925,188 - Nishino , et al. January 6, 2 | 2015-01-06 |
Part mounting method Grant 8,769,810 - Nishino , et al. July 8, 2 | 2014-07-08 |
Manufacturing apparatus and method for optical waveguide structure Grant 8,431,052 - Ikura April 30, 2 | 2013-04-30 |
Method of encapsulating an electronic component Grant 8,065,793 - Ikura , et al. November 29, 2 | 2011-11-29 |
Manufacturing Apparatus And Method For Optical Waveguide Structure App 20110174019 - IKURA; Kazuyuki | 2011-07-21 |
Ultrasonic bonding apparatus Grant 7,938,160 - Masuda , et al. May 10, 2 | 2011-05-10 |
Ultrasonic bonding apparatus Grant 7,905,268 - Masuda , et al. March 15, 2 | 2011-03-15 |
Mounting Apparatus And Mounting Method App 20100325884 - Nishino; Toru ;   et al. | 2010-12-30 |
Ultrasonic bonding apparatus Grant 7,823,618 - Masuda , et al. November 2, 2 | 2010-11-02 |
Observation apparatus and method for observing void in underfill resin Grant 7,790,499 - Sato , et al. September 7, 2 | 2010-09-07 |
Part Mounting Apparatus And Method App 20100132187 - Nishino; Toru ;   et al. | 2010-06-03 |
Application Method And Apparatus For Resin App 20100122457 - Ikura; Kazuyuki ;   et al. | 2010-05-20 |
Ultrasonic Bonding Apparatus App 20100038406 - MASUDA; Yasuyuki ;   et al. | 2010-02-18 |
Pressure-heating Apparatus And Method App 20100024667 - Ikura; Kazuyuki | 2010-02-04 |
Ultrasonic Bonding Apparatus App 20100006231 - MASUDA; Yasuyuki ;   et al. | 2010-01-14 |
Ultrasonic Bonding Apparatus App 20100006621 - MASUDA; Yasuyuki ;   et al. | 2010-01-14 |
Method of mounting an electronic part to a substrate Grant 7,513,032 - Shimamura , et al. April 7, 2 | 2009-04-07 |
Observation Apparatus And Method For Manufacturing Electronic Device App 20080194047 - SATO; Masahiko ;   et al. | 2008-08-14 |
Method of and apparatus for mounting an electronic part to a substrate App 20060091555 - Shimamura; Koichi ;   et al. | 2006-05-04 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.