Ikezawa; Ryoichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikezawa; Ryoichi.The latest application filed is for "epoxy resin molding material for sealing and electronic component device".

Company Profile

1.3.12

Ikezawa; Ryoichi - Tsukuba JP
Ikezawa; Ryoichi - Tsukuba-shi JP
Ikezawa; Ryoichi - Ibaraki JP
Ikezawa; Ryoichi - Ibaraki-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin molding material for sealing and electronic component device Grant 10,662,315 - Hamada , et al.	2020-05-26
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20170121505 - Hamada; Mitsuyoshi ; et al.	2017-05-04
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20140128505 - Hamada; Mitsuyoshi ; et al.	2014-05-08
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate Grant 7,544,727 - Ikezawa , et al. June 9, 2	2009-06-09
Encapsulated Epoxy-resin Molding Compound, And Electronic Component Device App 20090143511 - Ikezawa; Ryoichi ; et al.	2009-06-04
Encapsulated Epoxy Resin Composition And Electronic Component Device App 20090137717 - Ikezawa; Ryoichi ; et al.	2009-05-28
Epoxy Resin Composition for Sealing and Electronic Component Device App 20090062430 - Ikezawa; Ryoichi ; et al.	2009-03-05
Epoxy resin molding material for sealing use and semiconductor device Grant 7,397,139 - Ikezawa , et al. July 8, 2	2008-07-08
Encapsulated Epoxy-Resin Molding Compound, And Electronic Component Device App 20080039556 - Ikezawa; Ryoichi ; et al.	2008-02-14
Epoxy resin molding material for sealing use and semiconductor device App 20060214153 - Ikezawa; Ryoichi ; et al.	2006-09-28
Encapsulating epoxy resin molding material and semiconductor device App 20060074150 - Ikezawa; Ryoichi ; et al.	2006-04-06
Encapsulating epoxy resin composition, and electronic parts device using the same App 20060014873 - Ikezawa; Ryoichi ; et al.	2006-01-19
Encapsulating epoxy resin composition, and electronic parts device using the same App 20050222300 - Ikezawa, Ryoichi ; et al.	2005-10-06
Epoxy resin molding material for sealing App 20030201548 - Ikezawa, Ryoichi ; et al.	2003-10-30

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