Ikeya; Masahiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikeya; Masahiko.The latest application filed is for "method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore".

Company Profile

0.12.9

Ikeya; Masahiko - Sakai JP
Ikeya; Masahiko - Neyagawa-shi JP
Ikeya; Masahiko - Neyagawa JP
Ikeya; Masahiko - Osaka JP
Ikeya, Masahiko - Sakai-shi JP
Ikeya, Masahiko - Sakai-shi Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,516,878 - Narita , et al. April 14, 2	2009-04-14
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20080179378 - Imanishi; Makoto ; et al.	2008-07-31
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore Grant 7,387,229 - Imanishi , et al. June 17, 2	2008-06-17
Apparatus and method for forming bump Grant 7,350,684 - Narita , et al. April 1, 2	2008-04-01
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,052,984 - Narita , et al. May 30, 2	2006-05-30
Bump formation method and bump forming apparatus for semiconductor wafer App 20060102701 - Narita; Shoriki ; et al.	2006-05-18
Method and apparatus for correcting inclination of IC on semiconductor wafer Grant 7,031,509 - Narita , et al. April 18, 2	2006-04-18
Component mounting apparatus and component mounting method Grant 7,021,357 - Katano , et al. April 4, 2	2006-04-04
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate Grant 7,014,092 - Narita , et al. March 21, 2	2006-03-21
Bump Forming Apparatus For Charge Appearance Semiconductor Substrate, Charge Removal Method For Charge Appearance Semiconductor Substrate, Charge Removing Unit For Charge Appearance Semiconductor Substrate, And Charge Appearance Semiconductor Substrate Grant 7,005,368 - Narita , et al. February 28, 2	2006-02-28
Apparatus and method for forming bump App 20050191838 - Narita, Shoriki ; et al.	2005-09-01
Device and method for forming bump Grant 6,910,613 - Narita , et al. June 28, 2	2005-06-28
Electric Charge Generating Semiconductor Substrate Bump Forming Device, Method Of Removing Electric Charge From Electric Charge Generating Semiconductor Substrate Device For Removing Electric Charge From Electric Charge Generating Semiconductor Substrate, And Electric Charge Generating Semiconductor Grant 6,818,975 - Narita , et al. November 16, 2	2004-11-16
Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor Grant 6,787,391 - Imanishi , et al. September 7, 2	2004-09-07
Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore App 20040149803 - Imanishi, Makoto ; et al.	2004-08-05
Device and method for forming bump App 20040102030 - Narita, Shoriki ; et al.	2004-05-27
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate App 20040035849 - Narita, Shoriki ; et al.	2004-02-26
Bump formation method and bump forming apparatus to semiconductor wafer App 20040020973 - Narita, Shoriki ; et al.	2004-02-05
Component mounting apparatus and component mounting method App 20030070280 - Katano, Ryoichiro ; et al.	2003-04-17
Method and apparatus for correcting inclination of IC on semiconductor wafer App 20020061129 - Narita, Shoriki ; et al.	2002-05-23
Bump forming method and bump bonder Grant 6,098,868 - Mae , et al. August 8, 2	2000-08-08

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