Ikejima; Hiroshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ikejima; Hiroshi.The latest application filed is for "composite layered chip package".
Company Profile
2.37.23
- Ikejima; Hiroshi - Hong Kong N/A CN
- - Hong Kong CN
- IKEJIMA; Hiroshi - Shatin CN
Patent Activity
| Patent | Date |
|---|---|
| Method of manufacturing layered chip package Grant 8,652,877 - Sasaki , et al. February 18, 2 | 2014-02-18 |
| Layered chip package and method of manufacturing same Grant 8,653,639 - Sasaki , et al. February 18, 2 | 2014-02-18 |
| Layered chip package and method of manufacturing same Grant 8,618,646 - Sasaki , et al. December 31, 2 | 2013-12-31 |
| Layered chip package and method of manufacturing same Grant 08618646 - | 2013-12-31 |
| Layered chip package and method of manufacturing same Grant 8,541,887 - Sasaki , et al. September 24, 2 | 2013-09-24 |
| Method of manufacturing layered chip package Grant 8,513,034 - Sasaki , et al. August 20, 2 | 2013-08-20 |
| Layered chip package Grant 8,466,562 - Sasaki , et al. June 18, 2 | 2013-06-18 |
| Ceramic capacitor and method of manufacturing same Grant 8,462,482 - Sasaki , et al. June 11, 2 | 2013-06-11 |
| Method of manufacturing layered chip package Grant 8,441,112 - Sasaki , et al. May 14, 2 | 2013-05-14 |
| Ceramic capacitor and method of manufacturing same Grant 8,432,662 - Sasaki , et al. April 30, 2 | 2013-04-30 |
| Composite layered chip package Grant 8,426,979 - Sasaki , et al. April 23, 2 | 2013-04-23 |
| Layered chip package and method of manufacturing same Grant 8,421,243 - Sasaki , et al. April 16, 2 | 2013-04-16 |
| Layered chip package and method of manufacturing same Grant 8,362,602 - Sasaki , et al. January 29, 2 | 2013-01-29 |
| Composite Layered Chip Package App 20130020723 - SASAKI; Yoshitaka ; et al. | 2013-01-24 |
| Layered chip package and method of manufacturing same Grant 8,358,015 - Sasaki , et al. January 22, 2 | 2013-01-22 |
| Layered chip package and method of manufacturing same Grant 8,344,494 - Sasaki , et al. January 1, 2 | 2013-01-01 |
| Layered Chip Package And Method Of Manufacturing Same App 20120313259 - SASAKI; Yoshitaka ; et al. | 2012-12-13 |
| Layered Chip Package And Method Of Manufacturing Same App 20120313260 - SASAKI; Yoshitaka ; et al. | 2012-12-13 |
| Layered chip package with wiring on the side surfaces Grant 8,324,741 - Sasaki , et al. December 4, 2 | 2012-12-04 |
| Layered Chip Package And Method Of Manufacturing Same App 20120256321 - SASAKI; Yoshitaka ; et al. | 2012-10-11 |
| Layered chip package and method of manufacturing the same Grant 8,253,257 - Sasaki , et al. August 28, 2 | 2012-08-28 |
| Layered Chip Package And Method Of Manufacturing The Same App 20120187575 - SASAKI; Yoshitaka ; et al. | 2012-07-26 |
| Layered chip package and method of manufacturing same Grant 8,203,216 - Sasaki , et al. June 19, 2 | 2012-06-19 |
| Layered chip package and method of manufacturing same Grant 8,203,215 - Sasaki , et al. June 19, 2 | 2012-06-19 |
| Method Of Manufacturing Layered Chip Package App 20120142146 - SASAKI; Yoshitaka ; et al. | 2012-06-07 |
| Method of manufacturing ceramic capacitor Grant 8,171,607 - Sasaki , et al. May 8, 2 | 2012-05-08 |
| Layered Chip Package And Method Of Manufacturing Same App 20120086130 - SASAKI; Yoshitaka ; et al. | 2012-04-12 |
| Layered chip package with heat sink Grant 8,154,116 - Sasaki , et al. April 10, 2 | 2012-04-10 |
| Method Of Manufacturing Layered Chip Package App 20120080782 - SASAKI; Yoshitaka ; et al. | 2012-04-05 |
| Layered Chip Package And Method Of Manufacturing Same App 20120056333 - SASAKI; Yoshitaka ; et al. | 2012-03-08 |
| Layered Chip Package And Method Of Manufacturing Same App 20120032318 - Sasaki; Yoshitaka ; et al. | 2012-02-09 |
| Layered Chip Package and Method of Manufacturing Same App 20120013024 - SASAKI; Yoshitaka ; et al. | 2012-01-19 |
| Layered Chip Package and Method of Manufacturing Same App 20120013025 - Sasaki; Yoshitaka ; et al. | 2012-01-19 |
| Layered Chip Package And Method Of Manufacturing Same App 20110316141 - Sasaki; Yoshitaka ; et al. | 2011-12-29 |
| Layered chip package with wiring on the side surfaces App 20110221073 - Sasaki; Yoshitaka ; et al. | 2011-09-15 |
| Method of manufacturing layered chip package App 20110201137 - Sasaki; Yoshitaka ; et al. | 2011-08-18 |
| Layered chip package with wiring on the side surfaces Grant 7,968,374 - Sasaki , et al. June 28, 2 | 2011-06-28 |
| Layered chip package and method of manufacturing same Grant 7,964,976 - Sasaki , et al. June 21, 2 | 2011-06-21 |
| Method of manufacturing layered chip package Grant 7,915,083 - Sasaki , et al. March 29, 2 | 2011-03-29 |
| Layered chip package and method of manufacturing same App 20110068456 - Sasaki; Yoshitaka ; et al. | 2011-03-24 |
| Composite layered chip package and method of manufacturing same Grant 7,902,677 - Sasaki , et al. March 8, 2 | 2011-03-08 |
| Layered chip package and method of manufacturing same App 20100200977 - Sasaki; Yoshitaka ; et al. | 2010-08-12 |
| Method Of Manufacturing Ceramic Capacitor App 20100192343 - Sasaki; Yoshitaka ; et al. | 2010-08-05 |
| Ceramic Capacitor And Method Of Manufacturing Same App 20100195264 - Sasaki; Yoshitaka ; et al. | 2010-08-05 |
| Ceramic Capacitor And Method Of Manufacturing Same App 20100195262 - SASAKI; Yoshitaka ; et al. | 2010-08-05 |
| Layered chip package with heat sink App 20100109137 - Sasaki; Yoshitaka ; et al. | 2010-05-06 |
| Layered chip package and method of manufacturing same App 20100044879 - Sasaki; Yoshitaka ; et al. | 2010-02-25 |
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