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name:-0.0022468566894531
name:-0.0005338191986084
Ikegami; Tetsuma Patent Filings

Ikegami; Tetsuma

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikegami; Tetsuma.The latest application filed is for "substrate plating method and apparatus".

Company Profile
0.3.3
  • Ikegami; Tetsuma - Tokyo JP
  • Ikegami; Tetsuma - Yokohama JP
  • Ikegami; Tetsuma - Yokohama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate plating method and apparatus
App 20060144714 - Hongo; Akihisa ;   et al.
2006-07-06
Substrate plating method and apparatus
Grant 7,033,463 - Hongo , et al. April 25, 2
2006-04-25
Turbo-molecular pump
Grant 6,953,317 - Ikegami , et al. October 11, 2
2005-10-11
Turbo-molecular pump
Grant 6,926,493 - Miyamoto , et al. August 9, 2
2005-08-09
Turbo-molecular pump
App 20020028132 - Ikegami, Tetsuma ;   et al.
2002-03-07
Turbo-molecular Pump
App 20010016160 - IKEGAMI, TETSUMA ;   et al.
2001-08-23

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