Ikedo; Yuichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ikedo; Yuichi.The latest application filed is for "sealing resin, semiconductor device, and photocoupler".
- Ikedo; Yuichi - Fukuoka-ken JP
- Ikedo; Yuichi - Kanazawa Ishikawa JP
| Patent | Date |
|---|---|
| Sealing Resin, Semiconductor Device, And Photocoupler App 20160197224 - Muranaka; Tetsuya ; et al. | 2016-07-07 |
| Photocoupler Grant 9,355,925 - Muranaka , et al. May 31, 2 | 2016-05-31 |
| Photocoupler App 20160013113 - Muranaka; Tetsuya ; et al. | 2016-01-14 |
| Photocoupler Grant 9,171,829 - Muranaka , et al. October 27, 2 | 2015-10-27 |
| Sealing Resin, Semiconductor Device, And Photocoupler App 20150295121 - Muranaka; Tetsuya ; et al. | 2015-10-15 |
| Photocoupler App 20150262982 - Muranaka; Tetsuya ; et al. | 2015-09-17 |
| Sealing Resin, Semiconductor Device, And Photocoupler App 20150076524 - Muranaka; Tetsuya ; et al. | 2015-03-19 |
| Light emitting device Grant 8,610,166 - Takeshita , et al. December 17, 2 | 2013-12-17 |
| Light Emitting Device App 20130062613 - Takeshita; Atsushi ; et al. | 2013-03-14 |
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