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Patent applications and USPTO patent grants for Ikeda; Yasunobu.The latest application filed is for "method for manufacturing bonded soi wafer and bonded soi wafer manufactured thereby".
Patent | Date |
---|---|
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby Grant 7,528,049 - Ikeda , et al. May 5, 2 | 2009-05-05 |
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby App 20080020541 - Ikeda; Yasunobu ;   et al. | 2008-01-24 |
Portable electronic equipment and battery mounting device of the equipment Grant 7,043,282 - Inomata , et al. May 9, 2 | 2006-05-09 |
Portable telephone Grant 6,968,161 - Inomata , et al. November 22, 2 | 2005-11-22 |
Card holding structure and portable terminal apparatus having the same Grant 6,947,767 - Haga , et al. September 20, 2 | 2005-09-20 |
Card connector and portable telephone having the same Grant 6,942,154 - Haga , et al. September 13, 2 | 2005-09-13 |
Printed circuit board holding structure Grant 6,809,933 - Kuchiishi , et al. October 26, 2 | 2004-10-26 |
Portable electronic equipment and battery mounting device of the equipment App 20040048638 - Inomata, Yoji ;   et al. | 2004-03-11 |
Method for bonding substrates Grant 6,620,285 - Tomita , et al. September 16, 2 | 2003-09-16 |
Card holding structure and portable terminal apparatus having the same App 20030134602 - Haga, Hideo ;   et al. | 2003-07-17 |
Internal battery holding structure in mobile equipment Grant 6,515,450 - Kaiho , et al. February 4, 2 | 2003-02-04 |
Printed circuit board holding structure App 20030007333 - Kuchiishi, Koji ;   et al. | 2003-01-09 |
Method for bonding substrates App 20020040754 - Tomita, Shinichi ;   et al. | 2002-04-11 |
Portable telephone App 20010024945 - Inomata, Yoji ;   et al. | 2001-09-27 |
Electronic equipment device having clamps Grant 5,636,105 - Inomata , et al. June 3, 1 | 1997-06-03 |
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