loadpatents
name:-0.0085229873657227
name:-0.010607957839966
name:-0.00050210952758789
Ikeda; Yasunobu Patent Filings

Ikeda; Yasunobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikeda; Yasunobu.The latest application filed is for "method for manufacturing bonded soi wafer and bonded soi wafer manufactured thereby".

Company Profile
0.9.6
  • Ikeda; Yasunobu - Tokyo JP
  • Ikeda; Yasunobu - Yokohama JP
  • Ikeda, Yasunobu - Yokohama-shi JP
  • Ikeda; Yasunobu - Saga JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby
Grant 7,528,049 - Ikeda , et al. May 5, 2
2009-05-05
Method for manufacturing bonded SOI wafer and bonded SOI wafer manufactured thereby
App 20080020541 - Ikeda; Yasunobu ;   et al.
2008-01-24
Portable electronic equipment and battery mounting device of the equipment
Grant 7,043,282 - Inomata , et al. May 9, 2
2006-05-09
Portable telephone
Grant 6,968,161 - Inomata , et al. November 22, 2
2005-11-22
Card holding structure and portable terminal apparatus having the same
Grant 6,947,767 - Haga , et al. September 20, 2
2005-09-20
Card connector and portable telephone having the same
Grant 6,942,154 - Haga , et al. September 13, 2
2005-09-13
Printed circuit board holding structure
Grant 6,809,933 - Kuchiishi , et al. October 26, 2
2004-10-26
Portable electronic equipment and battery mounting device of the equipment
App 20040048638 - Inomata, Yoji ;   et al.
2004-03-11
Method for bonding substrates
Grant 6,620,285 - Tomita , et al. September 16, 2
2003-09-16
Card holding structure and portable terminal apparatus having the same
App 20030134602 - Haga, Hideo ;   et al.
2003-07-17
Internal battery holding structure in mobile equipment
Grant 6,515,450 - Kaiho , et al. February 4, 2
2003-02-04
Printed circuit board holding structure
App 20030007333 - Kuchiishi, Koji ;   et al.
2003-01-09
Method for bonding substrates
App 20020040754 - Tomita, Shinichi ;   et al.
2002-04-11
Portable telephone
App 20010024945 - Inomata, Yoji ;   et al.
2001-09-27
Electronic equipment device having clamps
Grant 5,636,105 - Inomata , et al. June 3, 1
1997-06-03

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