IKEDA; Tomoyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for IKEDA; Tomoyuki.The latest application filed is for "wiring substrate".
- IKEDA; Tomoyuki - Ogaki JP
- Ikeda; Tomoyuki - Osaka JP
- Ikeda; Tomoyuki - Osaka-shi JP
- IKEDA; Tomoyuki - Ibi-gun JP
- Ikeda; Tomoyuki - Gifu JP
- Ikeda; Tomoyuki - Tsukuba JP
| Patent | Date |
|---|---|
| Wiring Substrate App 20220223532 - IKEDA; Tomoyuki ; et al. | 2022-07-14 |
| Wiring substrate Grant 11,277,910 - Kunikane , et al. March 15, 2 | 2022-03-15 |
| Wiring substrate and method for manufacturing wiring substrate Grant 11,089,674 - Ikeda , et al. August 10, 2 | 2021-08-10 |
| Wiring Substrate App 20210045238 - Kunikane; Shigemitsu ; et al. | 2021-02-11 |
| Wiring Substrate And Method For Manufacturing Wiring Substrate App 20200389969 - IKEDA; Tomoyuki ; et al. | 2020-12-10 |
| Engine system Grant 10,344,661 - Ikeda , et al. July 9, 2 | 2019-07-09 |
| Engine system Grant 10,291,100 - Ikeda , et al. | 2019-05-14 |
| Wiring board with built-in electronic component and method for manufacturing the same Grant 9,807,885 - Sakai , et al. October 31, 2 | 2017-10-31 |
| Wiring Board With Built-in Electronic Component And Method For Manufacturing The Same App 20160316566 - SAKAI; Kenji ; et al. | 2016-10-27 |
| Engine System App 20160090893 - Ikeda; Tomoyuki ; et al. | 2016-03-31 |
| Engine System App 20160043611 - Ikeda; Tomoyuki ; et al. | 2016-02-11 |
| Method For Manufacturing Printed Wiring Board App 20150216055 - IKEDA; Tomoyuki | 2015-07-30 |
| Multilayer printed wiring board Grant 9,040,843 - Toyoda , et al. May 26, 2 | 2015-05-26 |
| Method for manufacturing a printed wiring board having a through-hole conductor Grant 9,029,711 - Ikeda May 12, 2 | 2015-05-12 |
| Method of manufacturing a multilayered printed wiring board Grant 8,966,750 - Ikeda , et al. March 3, 2 | 2015-03-03 |
| Printed wiring board having through-hole and a method of production thereof Grant 8,890,000 - Ikeda November 18, 2 | 2014-11-18 |
| Multilayer Printed Wiring Board App 20130008701 - TOYODA; Yukihiko ; et al. | 2013-01-10 |
| Multilayer printed wiring board Grant 8,324,512 - Toyoda , et al. December 4, 2 | 2012-12-04 |
| Printed wiring board and a method of production thereof Grant 8,324,506 - Ikeda December 4, 2 | 2012-12-04 |
| Multilayered printed wiring board with a multilayered core substrate Grant 8,242,379 - Ikeda , et al. August 14, 2 | 2012-08-14 |
| Printed Wiring Board And A Method Of Production Thereof App 20120175155 - IKEDA; Tomoyuki | 2012-07-12 |
| Printed wiring board and a method of production thereof Grant 8,101,865 - Ikeda January 24, 2 | 2012-01-24 |
| Printed Wiring Board And A Method Of Production Thereof App 20120012464 - IKEDA; Tomoyuki | 2012-01-19 |
| Multilayered Printed Wiring Board App 20110247208 - IKEDA; Tomoyuki ; et al. | 2011-10-13 |
| Multilayer printed wiring board Grant 8,030,579 - Toyoda , et al. October 4, 2 | 2011-10-04 |
| Multilayer Printed Wiring Board App 20110108311 - TOYODA; Yukihiko ; et al. | 2011-05-12 |
| Manufacturing method of multilayer core board Grant 7,905,014 - Ikeda March 15, 2 | 2011-03-15 |
| Printed wiring board and a method of production thereof Grant 7,786,390 - Ikeda August 31, 2 | 2010-08-31 |
| Printed Wiring Board And A Method Of Production Thereof App 20100155112 - IKEDA; Tomoyuki | 2010-06-24 |
| Printed Wiring Board And A Method Of Production Thereof App 20100089632 - Ikeda; Tomoyuki | 2010-04-15 |
| Printed Wiring Board And A Method Of Production Thereof App 20080257591 - IKEDA; Tomoyuki | 2008-10-23 |
| Multilayer Printed Wiring Board App 20080190658 - TOYODA; Yukihiko ; et al. | 2008-08-14 |
| Multilayer core board and manufacturing method thereof Grant 7,378,602 - Ikeda May 27, 2 | 2008-05-27 |
| Multilayer printed wiring board Grant 7,371,974 - Toyoda , et al. May 13, 2 | 2008-05-13 |
| Multilayered Printed Wiring Board App 20080107863 - Ikeda; Tomoyuki ; et al. | 2008-05-08 |
| Multilayer Core Board And Manufacturing Method Thereof App 20070271783 - IKEDA; Tomoyuki | 2007-11-29 |
| Multilayer core board and manufacturing method thereof App 20060083895 - Ikeda; Tomoyuki | 2006-04-20 |
| Multilayered printed wiring board App 20030178229 - Toyoda, Yukihiko ; et al. | 2003-09-25 |
| Fluorine-containing polyfunctional (meth) acrylate, fluorine containing monomer composition, low refractivity material, and reflection reducing film Grant 6,254,973 - Yoshida , et al. July 3, 2 | 2001-07-03 |
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