IKEDA; Kosuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for IKEDA; Kosuke.The latest application filed is for "determination apparatus, test system, determination method, and computer- readable medium".
Company Profile
17.37.54
- IKEDA; Kosuke - Saitama JP
- Ikeda; Kosuke - Hanno JP
- IKEDA; Kosuke - Ogaki JP
- Ikeda; Kosuke - Tokyo JP
- IKEDA; Kosuke - Hanno-shi JP
- IKEDA; Kosuke - US
- IKEDA; Kosuke - Ogaki-shi JP
Patent Activity
| Patent | Date |
|---|---|
| Determination Apparatus, Test System, Determination Method, And Computer- Readable Medium App 20220300390 - IKEDA; Kosuke ; et al. | 2022-09-22 |
| Electronic module and method for manufacturing electronic module Grant 11,437,298 - Matsuzaki , et al. September 6, 2 | 2022-09-06 |
| Electronic module, method of manufacturing connector, and method of manufacturing electronic module Grant 11,437,340 - Ikeda , et al. September 6, 2 | 2022-09-06 |
| Electronic module Grant 11,322,448 - Ikeda May 3, 2 | 2022-05-03 |
| Electronic module Grant 11,309,250 - Ikeda April 19, 2 | 2022-04-19 |
| Electronic module Grant 11,309,273 - Ikeda , et al. April 19, 2 | 2022-04-19 |
| Electronic module Grant 11,276,663 - Ikeda , et al. March 15, 2 | 2022-03-15 |
| Method of manufacturing chip module Grant 11,264,351 - Ikeda , et al. March 1, 2 | 2022-03-01 |
| Wiring Substrate And Method For Manufacturing Wiring Substrate App 20220046795 - IKEDA; Kosuke | 2022-02-10 |
| Examination apparatus, examination method, recording medium storing an examination program, learning apparatus, learning method, and recording medium storing a learning program Grant 11,244,443 - Ikeda , et al. February 8, 2 | 2022-02-08 |
| Electronic module Grant 11,189,591 - Ikeda , et al. November 30, 2 | 2021-11-30 |
| Method for manufacturing impeller Grant 11,161,290 - Okabe , et al. November 2, 2 | 2021-11-02 |
| Electronic Device App 20210272749 - IKEDA; Kosuke ; et al. | 2021-09-02 |
| Electronic Device App 20210272748 - IKEDA; Kosuke ; et al. | 2021-09-02 |
| Electronic Device App 20210272746 - IKEDA; Kosuke ; et al. | 2021-09-02 |
| Pultruded material and method for manufacturing pultruded material Grant 11,104,769 - Takeuchi , et al. August 31, 2 | 2021-08-31 |
| Magnetic Component App 20210265103 - IKEDA; Kosuke ; et al. | 2021-08-26 |
| Electronic Module App 20210210422 - IKEDA; Kosuke ; et al. | 2021-07-08 |
| Exhaust device for inkjet coating, inkjet ejection device, inkjet coating method, and method for manufacturing member Grant 11,052,674 - Nohara , et al. July 6, 2 | 2021-07-06 |
| Electronic Module App 20210202369 - IKEDA; Kosuke ; et al. | 2021-07-01 |
| Electronic Module App 20210183807 - IKEDA; Kosuke ; et al. | 2021-06-17 |
| Electronic module, lead frame and manufacturing method for electronic module Grant 11,037,870 - Ikeda , et al. June 15, 2 | 2021-06-15 |
| Molding Method And Molding Device App 20210170654 - IKEDA; Kosuke ; et al. | 2021-06-10 |
| Electronic Module App 20210175198 - IKEDA; Kosuke ; et al. | 2021-06-10 |
| Method Of Manufacturing Chip Module App 20210175197 - IKEDA; Kosuke ; et al. | 2021-06-10 |
| Composite Material Injection Molding Method And Composite Material App 20210162637 - WATANABE; Yasunori ; et al. | 2021-06-03 |
| Electronic Module App 20210134763 - IKEDA; Kosuke | 2021-05-06 |
| Electronic Module App 20210123954 - IKEDA; Kosuke ; et al. | 2021-04-29 |
| Molding Method And Molding Device App 20210122094 - OZAKI; Ryota ; et al. | 2021-04-29 |
| Electronic Module App 20210091004 - IKEDA; Kosuke | 2021-03-25 |
| Electronic Module, Lead Frame And Manufacturing Method For Electronic Module App 20210043554 - IKEDA; Kosuke ; et al. | 2021-02-11 |
| Examination Apparatus, Examination Method, Recording Medium Storing An Examination Program, Learning Apparatus, Learning Method, And Recording Medium Storing A Learning Program App 20210027443 - IKEDA; Kosuke ; et al. | 2021-01-28 |
| Electronic Module App 20200343189 - IKEDA; Kosuke | 2020-10-29 |
| Electronic Module, Method Of Manufacturing Connector, And Method Of Manufacturing Electronic Module App 20200273833 - IKEDA; Kosuke ; et al. | 2020-08-27 |
| Coil structure and magnetic component Grant 10,748,700 - Ikeda , et al. A | 2020-08-18 |
| Exhaust Device For Inkjet Coating, Inkjet Ejection Device, Inkjet Coating Method, And Method For Manufacturing Member App 20200254798 - Kind Code | 2020-08-13 |
| Semiconductor module Grant 10,692,810 - Ikeda , et al. | 2020-06-23 |
| Pultruded Material And Method For Manufacturing Pultruded Material App 20200181339 - Takeuchi; Yukio ; et al. | 2020-06-11 |
| Electronic Module App 20200161270 - IKEDA; Kosuke ; et al. | 2020-05-21 |
| Impeller Grant 10,641,276 - Okabe , et al. | 2020-05-05 |
| Electronic module Grant 10,510,636 - Ikeda , et al. Dec | 2019-12-17 |
| Electronic Module And Method For Manufacturing Electronic Module App 20190371703 - MATSUZAKI; Osamu ; et al. | 2019-12-05 |
| Method For Determining Thickness Of Resin Layer Of Insert Film, Method For Manufacturing Insert Film-equipped Molded Resin Artic App 20190329464 - IKEDA; Kosuke ; et al. | 2019-10-31 |
| Semiconductor module Grant 10,461,042 - Ikeda , et al. Oc | 2019-10-29 |
| Semiconductor device and method for manufacturing semiconductor device Grant 10,461,062 - Ikeda Oc | 2019-10-29 |
| Magnetic component Grant 10,410,784 - Ikeda , et al. Sept | 2019-09-10 |
| Semiconductor module Grant 10,319,704 - Ikeda , et al. | 2019-06-11 |
| Semiconductor device and method for manufacturing semiconductor device Grant 10,269,775 - Ikeda | 2019-04-23 |
| Heat dissipating structure Grant 10,251,256 - Ikeda , et al. | 2019-04-02 |
| Semiconductor Module App 20190088594 - IKEDA; Kosuke ; et al. | 2019-03-21 |
| Electronic Module App 20190035707 - IKEDA; Kosuke | 2019-01-31 |
| Heat dissipating structure Grant 10,159,166 - Ikeda , et al. Dec | 2018-12-18 |
| Impeller App 20180266427 - OKABE; Ryoji ; et al. | 2018-09-20 |
| Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same Grant 10,070,523 - Sakai , et al. September 4, 2 | 2018-09-04 |
| Semiconductor Module App 20180226356 - IKEDA; Kosuke ; et al. | 2018-08-09 |
| Semiconductor Device And Method For Manufacturing Semiconductor Device App 20180219004 - IKEDA; Kosuke | 2018-08-02 |
| Semiconductor Device And Method For Manufacturing Semiconductor Device App 20180219003 - IKEDA; Kosuke | 2018-08-02 |
| Semiconductor Module App 20180182745 - IKEDA; Kosuke ; et al. | 2018-06-28 |
| Magnetic Component App 20180166207 - IKEDA; Kosuke ; et al. | 2018-06-14 |
| Coil Structure And Magnetic Component App 20180166208 - IKEDA; Kosuke ; et al. | 2018-06-14 |
| Power semiconductor module for improved thermal performance Grant 9,997,437 - Ikeda June 12, 2 | 2018-06-12 |
| Electronic module and method of manufacturing the same Grant 9,991,184 - Ikeda June 5, 2 | 2018-06-05 |
| Semiconductor module having stacked insulated substrate structures Grant 9,892,993 - Ikeda February 13, 2 | 2018-02-13 |
| Method For Manufacturing Impeller App 20180029273 - OKABE; Ryoji ; et al. | 2018-02-01 |
| Authentication terminal Grant 9,871,788 - Degawa , et al. January 16, 2 | 2018-01-16 |
| Authentication system, authentication method and service providing system Grant 9,871,789 - Degawa , et al. January 16, 2 | 2018-01-16 |
| Heat Dissipating Structure App 20170311482 - IKEDA; Kosuke ; et al. | 2017-10-26 |
| Heat Dissipating Structure App 20170303385 - Ikeda; Kosuke ; et al. | 2017-10-19 |
| Wiring substrate and method for manufacturing the same Grant 9,775,237 - Ikeda September 26, 2 | 2017-09-26 |
| Electronic Component Built-in Substrate And Method For Manufacturing The Same App 20170263571 - ISHIHARA; Teruyuki ; et al. | 2017-09-14 |
| Semiconductor module Grant 9,704,828 - Ikeda , et al. July 11, 2 | 2017-07-11 |
| Printed Wiring Board And Method For Manufacturing Printed Wiring Board App 20170196096 - ISHIHARA; Teruyuki ; et al. | 2017-07-06 |
| Injection molding apparatus and injection molding method Grant 9,669,573 - Kariya , et al. June 6, 2 | 2017-06-06 |
| Semiconductor Module And Method For Manufacturing Semiconductor Module App 20170133294 - IKEDA; Kosuke | 2017-05-11 |
| Semiconductor Module App 20170092568 - IKEDA; Kosuke | 2017-03-30 |
| Printed Wiring Board And Semiconductor Package App 20170053878 - KAJIHARA; Kazuki ; et al. | 2017-02-23 |
| Wiring board and method for manufacturing the same Grant 9,538,642 - Ikeda January 3, 2 | 2017-01-03 |
| Wiring Substrate And Method For Manufacturing The Same App 20160338195 - IKEDA; Kosuke | 2016-11-17 |
| Printed Wiring Board And Method For Manufacturing The Same App 20160316558 - SAKAI; Shunsuke ; et al. | 2016-10-27 |
| Semiconductor Module App 20160254250 - IKEDA; Kosuke ; et al. | 2016-09-01 |
| Module, module combined body and module production method Grant 9,386,698 - Ikeda July 5, 2 | 2016-07-05 |
| Electronic Module And Method Of Manufacturing The Same App 20160181175 - IKEDA; Kosuke | 2016-06-23 |
| Authentication Terminal App 20160127361 - DEGAWA; Katsuhiko ; et al. | 2016-05-05 |
| Authentication System, Authentication Method And Service Providing System App 20160127362 - DEGAWA; Katsuhiko ; et al. | 2016-05-05 |
| Lubricating-oil composition for forging molding and forging molding apparatus Grant 9,296,035 - Horaguchi , et al. March 29, 2 | 2016-03-29 |
| Injection Molding Apparatus And Injection Molding Method App 20160009010 - KARIYA; Toshihiko ; et al. | 2016-01-14 |
| Module, Module Combined Body And Module Production Method App 20150189756 - Ikeda; Kosuke | 2015-07-02 |
| Wiring Board And Method For Manufacturing The Same App 20140251656 - IKEDA; Kosuke | 2014-09-11 |
| Lubricating-oil Composition For Forging Molding And Forging Molding Apparatus App 20120192609 - Horaguchi; Norihisa ; et al. | 2012-08-02 |
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