Ikeda; Hironobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikeda; Hironobu.The latest application filed is for "conductor, conductive composition and laminate".

Company Profile

3.14.10

Ikeda; Hironobu - Otake-shi JP
Ikeda; Hironobu - Otake JP
Ikeda; Hironobu - Chiyoda-ku JP
Ikeda; Hironobu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductor, Conductive Composition And Laminate App 20210319927 - FUKUDA; Hiroya ; et al.	2021-10-14
Conductor, conductive composition and laminate Grant 11,145,432 - Fukuda , et al. October 12, 2	2021-10-12
Polypropylene fiber and method for manufacturing polypropylene fiber Grant 10,870,929 - Fujie , et al. December 22, 2	2020-12-22
Electronic component, and electronic component manufacturing method Grant 10,643,976 - Otsuka , et al.	2020-05-05
Electronic component and electronic component manufacturing method Grant 10,334,721 - Ikeda	2019-06-25
Polyolefin Fiber And Method For Producing Same App 20190153626 - FUJIE; Masaki ; et al.	2019-05-23
Conductor, conductive composition and laminate Grant 10,096,395 - Fukuda , et al. October 9, 2	2018-10-09
Electronic Component, And Electronic Component Manufacturing Method App 20180261577 - OTSUKA; Yurika ; et al.	2018-09-13
Electronic Component And Electronic Component Manufacturing Method App 20180220528 - IKEDA; Hironobu	2018-08-02
Polypropylene Fiber And Method For Manufacturing Polypropylene Fiber App 20180202077 - FUJIE; Masaki ; et al.	2018-07-19
Conductor, Conductive Composition And Laminate App 20180174698 - FUKUDA; Hiroya ; et al.	2018-06-21
Conductor, Conductive Composition And Laminate App 20150132537 - Fukuda; Hiroya ; et al.	2015-05-14
Apparatus and method for adjusting position of electronic component Grant 7,896,658 - Ikeda March 1, 2	2011-03-01
Heat sink, an electronic component package, and a method of manufacturing a heat sink Grant 7,755,895 - Ikeda July 13, 2	2010-07-13
Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component Grant 7,671,477 - Ikeda March 2, 2	2010-03-02
Apparatus and method for adjusting position of electronic component App 20090068861 - Ikeda; Hironobu	2009-03-12
Device, And Manufacturing Method For The Device App 20070090528 - Ikeda; Hironobu	2007-04-26
Heat sink, an electronic component package, and a method of manufacturing a heat sink App 20060185896 - Ikeda; Hironobu	2006-08-24
Circuit board reducing a warp and a method of mounting an integrated circuit chip Grant 6,518,666 - Ikeda February 11, 2	2003-02-11
Mounting structure for an LSI Grant 6,285,553 - Suyama , et al. September 4, 2	2001-09-04
Semiconductor device package having a connection substrate with turned back leads and method thereof Grant 6,087,716 - Ikeda July 11, 2	2000-07-11
Mounting structure for one or more semiconductor devices Grant 5,973,930 - Ikeda , et al. October 26, 1	1999-10-26
Cooling structure for integrated circuit Grant 5,436,501 - Ikeda July 25, 1	1995-07-25
Cooling structure for integrated circuits Grant 5,285,351 - Ikeda February 8, 1	1994-02-08

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