Ikeda; Aya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ikeda; Aya.The latest application filed is for "curable composition for forming elastic resin layer".

Company Profile

3.4.6

Ikeda; Aya - Tokyo JP
IKEDA; Aya - Chiyoda-ku Tokyo
IKEDA; Aya - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element Grant 10,808,150 - Kato , et al. October 20, 2	2020-10-20
Curable Composition For Forming Elastic Resin Layer App 20190241694 - SHIBATA; Tomoaki ; et al.	2019-08-08
Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element Grant 10,358,580 - Ikeda , et al. July 23, 2	2019-07-23
Resin Composition, Method For Manufacturing Semiconductor Device Using Resin Composition, And Solid-state Imaging Element App 20180208807 - KATOU; Sadaaki ; et al.	2018-07-26
Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element Grant 9,920,227 - Katou , et al. March 20, 2	2018-03-20
Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element Grant 9,868,884 - Ikeda , et al. January 16, 2	2018-01-16
Resin Composition, Method For Manufacturing Semiconductor Device Using Resin Composition, And Solid-state Imaging Element App 20160355709 - KATOU; Sadaaki ; et al.	2016-12-08
Adhesive Composition, Resin Cured Product Obtained From Adhesive Composition, Method For Manufacturing Semiconductor Device Using Adhesive Composition, And Solid-state Imaging Element App 20160340554 - IKEDA; Aya ; et al.	2016-11-24
Adhesive Composition, Method For Manufacturing Semiconductor Device Using Adhesive Composition, And Solid-state Imaging Element App 20160340561 - Ikeda; Aya ; et al.	2016-11-24
Method For Manufacturing Adhesion Body, Method For Manufacturing Substrate With Adhesive Pattern, And Substrate With Adhesive Pattern App 20120202015 - IKEDA; Aya ; et al.	2012-08-09

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