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Patent applications and USPTO patent grants for IKEDA; Atsuo.The latest application filed is for "bag supply system and bag supply method".
Patent | Date |
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Bag Supply System And Bag Supply Method App 20220041316 - IKEDA; Atsuo ;   et al. | 2022-02-10 |
Layered Food Packaging System, Temperary Placement Apparatus, And Carrier Device App 20210371136 - KOIKE; Haruhiko ;   et al. | 2021-12-02 |
Motor controller and method for controlling motor Grant 10,069,445 - Yoshiura , et al. September 4, 2 | 2018-09-04 |
Motor Controller And Method For Controlling Motor App 20160149523 - YOSHIURA; Yasufumi ;   et al. | 2016-05-26 |
Bonding structure of bonding wire Grant 9,331,049 - Uno , et al. May 3, 2 | 2016-05-03 |
Bonding structure of multilayer copper bonding wire Grant 8,836,147 - Uno , et al. September 16, 2 | 2014-09-16 |
Copper bonding wire for semiconductor device and bonding structure thereof Grant 8,653,668 - Uno , et al. February 18, 2 | 2014-02-18 |
Bonding Structure Of Multilayer Copper Bonding Wire App 20130180757 - Uno; Tomohiro ;   et al. | 2013-07-18 |
Copper Bonding Wire For Semiconductor And Bonding Structure Thereof App 20120299182 - Uno; Tomohiro ;   et al. | 2012-11-29 |
Semiconductor mounting bonding wire Grant 8,097,960 - Terashima , et al. January 17, 2 | 2012-01-17 |
Bonding Structure Of Bonding Wire App 20110104510 - Uno; Tomohiro ;   et al. | 2011-05-05 |
Semiconductor Mounting Bonding Wire App 20090072399 - Terashima; Shinichi ;   et al. | 2009-03-19 |
Linear drive motor control system Grant 4,404,671 - Kuribayashi , et al. September 13, 1 | 1983-09-13 |
Linear-tracking pick-up arm drive assembly Grant 4,323,997 - Kuribayashi , et al. April 6, 1 | 1982-04-06 |
Electromagnetic linear-motion device Grant 4,259,602 - Kuribayashi , et al. March 31, 1 | 1981-03-31 |
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