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Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layer App 20090170252 - Nakagawa; Takashi ;   et al. | 2009-07-02 |
Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device Grant 7,545,040 - Ueki , et al. June 9, 2 | 2009-06-09 |
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Semiconductor device having high-permittivity insulation film and production method therefor Grant 7,164,169 - Watanabe , et al. January 16, 2 | 2007-01-16 |
Semiconductor device and production method therefor App 20060131670 - Ogura; Takashi ;   et al. | 2006-06-22 |
Copper alloy for wiring, semiconductor device, method for forming wiring and method for manufacturing semiconductor device App 20060113685 - Ueki; Makoto ;   et al. | 2006-06-01 |
Semiconductor device having high-piemittivity insulation film and production method therefor App 20040171276 - Watanabe, Heiji ;   et al. | 2004-09-02 |
Semiconductor device including a MIS transistor Grant 6,459,126 - Mogami , et al. October 1, 2 | 2002-10-01 |
Semiconductor device including a MIS transistor App 20020096721 - Mogami, Tohru ;   et al. | 2002-07-25 |