Iizuka; Minoru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iizuka; Minoru.The latest application filed is for "piezoelectric resonator device, and bonding structure of piezoelectric resonator device and circuit board".

Company Profile

2.14.12

Iizuka; Minoru - Kakogawa JP
IIZUKA; Minoru - Kakogawa-shi JP
Iizuka; Minoru - Chiyoda-ku JP
Iizuka; Minoru - Hyogo JP
Iizuka; Minoru - Himeji JP
Iizuka, Minoru - Himeji-shi JP
Iizuka; Minoru - Komukainishimachi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Piezoelectric resonator device Grant 10,630,255 - Iizuka , et al.	2020-04-21
Piezoelectric resonator device, and bonding structure of piezoelectric resonator device and circuit board Grant 10,333,053 - Iizuka , et al.	2019-06-25
Piezoelectric vibration device Grant D806,044 - Iizuka , et al. December 26, 2	2017-12-26
Piezoelectric Resonator Device, and Bonding Structure of Piezoelectric Resonator Device and Circuit Board App 20160329484 - IIZUKA; Minoru ; et al.	2016-11-10
Piezoelectric resonator device App 20160322952 - Iizuka; Minoru ; et al.	2016-11-03
Piezoelectric vibration device Grant D767,571 - Iizuka , et al. September 27, 2	2016-09-27
Piezoelectric vibration device Grant D760,230 - Iizuka , et al. June 28, 2	2016-06-28
Base of surface-mount electronic component package, and surface-mount electronic component package Grant 8,796,558 - Iizuka , et al. August 5, 2	2014-08-05
Electrical Insulating Oil Composition Having Excellent Low Temperature Properties App 20140110643 - Kimura; Nobuhiro ; et al.	2014-04-24
Base Of Surface-mount Electronic Component Package, And Surface-mount Electronic Component Package App 20130098654 - Iizuka; Minoru ; et al.	2013-04-25
Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate Grant 8,279,610 - Iizuka , et al. October 2, 2	2012-10-02
Electronic component package Grant 8,076,576 - Kumatani , et al. December 13, 2	2011-12-13
Piezoelectric resonator plate and piezoelectric resonator device Grant 8,004,157 - Iizuka , et al. August 23, 2	2011-08-23
Electronic Component Package, Base Of Electronic Component Package, And Junction Structure Of Electronic Component Package And Circuit Substrate App 20110114353 - Iizuka; Minoru ; et al.	2011-05-19
Piezoelectric Resonator Device App 20100033268 - Iizuka; Minoru ; et al.	2010-02-11
Electronic Component Package App 20100006315 - Kumatani; Kazuhiko ; et al.	2010-01-14
Piezoelectric Resonator Plate and Piezoelectric Resonator Device App 20080265717 - Iizuka; Minoru ; et al.	2008-10-30
Electronic component package and method of manufacturing same Grant 7,166,497 - Shiomi , et al. January 23, 2	2007-01-23
Electronic component package and method of manufacturing same Grant 6,849,939 - Shiomi , et al. February 1, 2	2005-02-01
Quartz oscillator device Grant 6,700,312 - Iizuka , et al. March 2, 2	2004-03-02
Electronic Component Package And Method Of Manufacturing Same App 20040023487 - Shiomi, Kazuhiro ; et al.	2004-02-05
Crystal vibration device App 20020158699 - Iizuka, Minoru ; et al.	2002-10-31
Photocurable resin composition for the preparation of a printed wiring board Grant 5,521,053 - Ikeda , et al. * May 28, 1	1996-05-28

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