Iizuka; Kazuhiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iizuka; Kazuhiro.The latest application filed is for "method for detoxifying asbestos, and treatment agent used in the method".
- Iizuka; Kazuhiro - Nagoya JP
- IIZUKA; Kazuhiro - Nagoya-shi JP
- Iizuka; Kazuhiro - Yokohama JP
- IIZUKA; Kazuhiro - Kanagawa JP
- Iizuka; Kazuhiro - Yokohama-shi JP
| Patent | Date |
|---|---|
| Method for detoxifying asbestos Grant 10,729,926 - Myoga , et al. | 2020-08-04 |
| Method for detoxifying asbestos Grant 10,722,742 - Myoga , et al. | 2020-07-28 |
| Method For Detoxifying Asbestos, And Treatment Agent Used In The Method App 20190374805 - MYOGA; Toshimitsu ; et al. | 2019-12-12 |
| Method For Detoxifying Asbestos, And Treatment Agent Used In The Method App 20190358480 - MYOGA; Toshimitsu ; et al. | 2019-11-28 |
| Test system and test method Grant 10,019,793 - Iizuka , et al. July 10, 2 | 2018-07-10 |
| Test System And Test Method App 20150279015 - IIZUKA; Kazuhiro ; et al. | 2015-10-01 |
| Inspection Method And Inspection Device Of Integrated Circuit Device App 20150070043 - NAKAI; Tomokazu ; et al. | 2015-03-12 |
| Separating Device And Separating Method App 20150064876 - IIZUKA; Kazuhiro | 2015-03-05 |
| Stack MCP and manufacturing method thereof Grant 7,833,836 - Takyu , et al. November 16, 2 | 2010-11-16 |
| Stack Mcp And Manufacturing Method Thereof App 20090111218 - TAKYU; Shinya ; et al. | 2009-04-30 |
| Stack MCP and manufacturing method thereof Grant 7,482,695 - Takyu , et al. January 27, 2 | 2009-01-27 |
| Stack MCP and manufacturing method thereof App 20070262445 - Takyu; Shinya ; et al. | 2007-11-15 |
| Portion of a semiconductor apparatus mounting-position accuracy measurement jig Grant D554,084 - Iizuka October 30, 2 | 2007-10-30 |
| Stack MCP Grant 7,285,864 - Takyu , et al. October 23, 2 | 2007-10-23 |
| Stack MCP and manufacturing method thereof App 20050179127 - Takyu, Shinya ; et al. | 2005-08-18 |
| Manufacturing method of semiconductor device App 20050026326 - Kiritani, Mika ; et al. | 2005-02-03 |
| Semiconductor device manufacturing method using ultrasonic flip chip bonding technique Grant 6,838,316 - Iizuka , et al. January 4, 2 | 2005-01-04 |
| Semiconductor device manufacturing method using ultrasonic flip chip bonding technique App 20030180986 - Iizuka, Kazuhiro ; et al. | 2003-09-25 |
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