Iioka; Shinji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iioka; Shinji.The latest application filed is for "punched adhesive tape for semicconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame".

Company Profile

0.4.4

Iioka; Shinji - Ichihara-shi JP
Iioka; Shinji - Ichihara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Punched Adhesive Tape For Semicconductor, Method Of Manufacturing Lead Frame With The Adhesive Tape, Lead Frame With The Adhesive Tape, And Semiconductor Device Comprising The Lead Frame App 20090022893 - Tanabe; Yoshiyuki ; et al.	2009-01-22
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 7,449,076 - Tanabe , et al. November 11, 2	2008-11-11
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 7,273,654 - Tanabe , et al. September 25, 2	2007-09-25
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame App 20060027312 - Tanabe; Yoshiyuki ; et al.	2006-02-09
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Grant 6,523,446 - Tanabe , et al. February 25, 2	2003-02-25
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame App 20030021990 - Tanabe, Yoshiyuki ; et al.	2003-01-30
Resin Composition And Adhesive Film App 20020151659 - SUZUKI, MASAHIRO ; et al.	2002-10-17
Adhesive film of quinoline polymer and bismaleimide Grant 6,462,148 - Suzuki , et al. October 8, 2	2002-10-08

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