| Patent | Date |
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Polyimide-based Polymer, Positive Photosensitive Resin Composition, Negative Photosensitive Resin Composition, Patterning Method, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component
App 20220289911 - URANO; Hiroyuki ; et al. | 2022-09-15 |
Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component
Grant 11,333,975 - Zubarev , et al. May 17, 2 | 2022-05-17 |
Photosensitive Resin Composition, Patterning Process, Method For Forming Cured Film, Interlayer Insulation Film, Surface Protective Film, And Electronic Component
App 20220091509 - URANO; Hiroyuki ; et al. | 2022-03-24 |
Negative Photosensitive Resin Composition, Patterning Process, Method For Forming Cured Film, Interlayer Insulation Film, Surface Protective Film, And Electronic Component
App 20220043348 - IIO; Masashi ; et al. | 2022-02-10 |
Positive Photosensitive Resin Composition, Positive Photosensitive Dry Film, Method For Producing Positive Photosensitive Dry Film, Patterning Process, Method For Forming Cured Film, Interlayer Insulation Film, Surface Protective Film, And Electronic Component
App 20220043351 - IIO; Masashi ; et al. | 2022-02-10 |
Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
Grant 11,150,556 - Takemura , et al. October 19, 2 | 2021-10-19 |
Novel Compound, Polyimide Resin And Method Of Producing The Same, Photosensitive Resin Composition, Patterning Method And Method Of Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component
App 20210317270 - Zubarev; Dmitry ; et al. | 2021-10-14 |
Polymer, Photosensitive Resin Composition, Patterning Method, Method Of Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component
App 20210317268 - Zubarev; Dmitry ; et al. | 2021-10-14 |
Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts
Grant 10,919,918 - Urano , et al. February 16, 2 | 2021-02-16 |
Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
Grant 10,816,900 - Urano , et al. October 27, 2 | 2020-10-27 |
Positive Photosensitive Resin Composition, Patterning Process, Method Of Forming Cured Film, Interlayer Insulation Film, Surface Protective Film, And Electronic Component
App 20200326624 - URANO; Hiroyuki ; et al. | 2020-10-15 |
Polymer Having A Structure Of Polyamide, Polyamide-imide, Or Polyimide, Photosensitive Resin Composition, Patterning Process, Ph
App 20200041903 - TAKEMURA; Katsuya ; et al. | 2020-02-06 |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured film
Grant 10,457,779 - Takemura , et al. Oc | 2019-10-29 |
Novel Tetracarboxylic Dianhydride, Polyimide Resin And Method For Producing The Same, Photosensitive Resin Compositions, Pattern
App 20190169211 - URANO; Hiroyuki ; et al. | 2019-06-06 |
Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured film
Grant 10,216,085 - Takemura , et al. Feb | 2019-02-26 |
Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured film
Grant 10,203,601 - Urano , et al. Feb | 2019-02-12 |
Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate
Grant 10,197,914 - Takemura , et al. Fe | 2019-02-05 |
Tetracarboxylic Acid Diester Compound, Polymer Of Polyimide Precursor And Method For Producing Same, Negative Photosensitive Resin Composition, Patterning Process, And Method For Forming Cured Film
App 20190018320 - URANO; Hiroyuki ; et al. | 2019-01-17 |
Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrate
Grant 10,114,287 - Urano , et al. October 30, 2 | 2018-10-30 |
Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatus
Grant 10,087,288 - Urano , et al. October 2, 2 | 2018-10-02 |
Polymer Of Polyimide Precursor, Positive Type Photosensitive Resin Composition, Negative Type Photosensitive Resin Composition, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Parts
App 20180275513 - TAKEMURA; Katsuya ; et al. | 2018-09-27 |
Tetracarboxylic Acid Diester Compound, Polymer Of Polyimide Precursor And Method For Producing Same, Negative Photosensitive Resin Composition, Patterning Process, And Method For Forming Cured Film
App 20180120702 - URANO; Hiroyuki ; et al. | 2018-05-03 |
Tetracarboxylic Acid Diester Compound, Polyimide Precursor Polymer And Method For Producing The Same, Negative Photosensitive Resin Composition, Patterning Process, And Method For Forming Cured Film
App 20180024434 - TAKEMURA; Katsuya ; et al. | 2018-01-25 |
Tetracarboxylic Acid Diester Compound, Polyimide Precursor Polymer And Method For Producing The Same, Negative Photosensitive Resin Composition, Positive Photosensitive Resin Composition, Patterning Process, And Method For Forming Cured Film
App 20170298186 - TAKEMURA; Katsuya ; et al. | 2017-10-19 |
Positive Photosensitive Resin Composition, Photo-curable Dry Film And Method For Producing The Same, Patterning Process, And Laminate
App 20170255097 - TAKEMURA; Katsuya ; et al. | 2017-09-07 |
Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrate
Grant 9,557,645 - Takemura , et al. January 31, 2 | 2017-01-31 |
Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrate
Grant 9,400,428 - Urano , et al. July 26, 2 | 2016-07-26 |
Silicone Skeleton-containing Polymer Compound, Chemically Amplified Negative Resist Composition, Photo-curable Dry Film And Method For Producing Same, Patterning Process, Layered Product, Substrate, And Semiconductor Apparatus
App 20160200877 - URANO; Hiroyuki ; et al. | 2016-07-14 |
Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting film
Grant 9,377,689 - Takemura , et al. June 28, 2 | 2016-06-28 |
Negative resist composition and patterning process using same
Grant 9,310,681 - Hatakeyama , et al. April 12, 2 | 2016-04-12 |
Silicone Skeleton-containing Polymer Compound And Method For Producing Same, Chemically Amplified Negative Resist Composition, Photo-curable Dry Film And Method For Producing Same, Patterning Process, Layered Product, And Substrate
App 20160097973 - URANO; Hiroyuki ; et al. | 2016-04-07 |
Silicone Structure-bearing Polymer, Negative Resist Composition, Photo-curable Dry Film, Patterning Process, And Electric/electronic Part-protecting Film
App 20160033865 - Takemura; Katsuya ; et al. | 2016-02-04 |
Positive Photosensitive Resin Composition, Photo-curable Dry Film And Method For Producing Same, Layered Product, Patterning Process, And Substrate
App 20150370166 - TAKEMURA; Katsuya ; et al. | 2015-12-24 |
Negative Resist Composition And Patterning Process Using Same
App 20150198883 - HATAKEYAMA; Jun ; et al. | 2015-07-16 |
Methods for manufacturing resin structure and micro-structure
Grant 9,017,928 - Hirano , et al. April 28, 2 | 2015-04-28 |
Chemically amplified positive resist composition and pattern forming process
Grant 9,017,905 - Iio , et al. April 28, 2 | 2015-04-28 |
Polymer Compound, Chemically Amplified Negative Resist Composition, Photo-curable Dry Film And Production Method Thereof, Layered Product, Patterning Process, And Substrate
App 20150056545 - URANO; Hiroyuki ; et al. | 2015-02-26 |
Methods for manufacturing resin structure and micro-structure
Grant 8,951,717 - Hirano , et al. February 10, 2 | 2015-02-10 |
Methods For Manufacturing Resin Structure And Micro-structure
App 20140220497 - Hirano; Yoshinori ; et al. | 2014-08-07 |
Patterning process
Grant 8,703,404 - Hatakeyama , et al. April 22, 2 | 2014-04-22 |
Chemically Amplified Positive Resist Composition And Pattern Forming Process
App 20140087294 - Iio; Masashi ; et al. | 2014-03-27 |
Methods For Manufacturing Resin Structure And Micro-structure
App 20140072914 - Hirano; Yoshinori ; et al. | 2014-03-13 |
Pattern forming process, chemically amplified positive resist composition, and resist-modifying composition
Grant 8,658,346 - Watanabe , et al. February 25, 2 | 2014-02-25 |
Resist-modifying composition and pattern forming process
Grant 8,426,105 - Watanabe , et al. April 23, 2 | 2013-04-23 |
Patterning Process And Resist Composition
App 20130065183 - Kobayashi; Tomohiro ; et al. | 2013-03-14 |
Pattern forming process and resist-modifying composition
Grant 8,367,310 - Watanabe , et al. February 5, 2 | 2013-02-05 |
Polymerizable Ester Compound, Polymer, Resist Composition, And Patterning Process
App 20130017484 - HASEGAWA; Koji ; et al. | 2013-01-17 |
Resist-modifying composition and pattern forming process
Grant 8,329,384 - Watanabe , et al. December 11, 2 | 2012-12-11 |
Patterning Process
App 20120202158 - Hatakeyama; Jun ; et al. | 2012-08-09 |
Positive resist composition and patterning process
Grant 7,985,528 - Nishi , et al. July 26, 2 | 2011-07-26 |
Pattern Forming Process, Chemically Amplified Positive Resist Composition, And Resist-modifying Composition
App 20110033799 - Watanabe; Takeru ; et al. | 2011-02-10 |
Resist-modifying Composition And Pattern Forming Process
App 20100297563 - Watanabe; Takeru ; et al. | 2010-11-25 |
Resist-modifying Composition And Pattern Forming Process
App 20100297554 - Watanabe; Takeru ; et al. | 2010-11-25 |
Pattern Forming Process And Resist-modifying Composition
App 20100209849 - Watanabe; Takeru ; et al. | 2010-08-19 |
Patterning Process And Resist Composition
App 20100159392 - Hatakeyama; Jun ; et al. | 2010-06-24 |
Patterning Process
App 20100086878 - Hatakeyama; Jun ; et al. | 2010-04-08 |
Positive Resist Composition And Patterning Process
App 20100062366 - Nishi; Tsunehiro ; et al. | 2010-03-11 |
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