Iio; Akira
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iio; Akira.The latest application filed is for "polymer particles and polishing material containing them".
- Iio; Akira - Tokyo JP
- Iio; Akira - Yokkaichi JP
| Patent | Date |
|---|---|
| Aqueous Dispersion, Aqueous Dispersion For Chemical Mechanical Polishing Used For Manufacture Of Semiconductor Devices, Method For Manufacture Of Semiconductor Devices, And Method For Formation Of Embedded Writing Grant 6,740,590 - Yano , et al. May 25, 2 | 2004-05-25 |
| Polymer particles and polishing material containing them App 20010039322 - Hattori, Masayuki ; et al. | 2001-11-08 |
| Process for producing hydrogenation product of ring-opening polymer Grant 5,202,388 - Iio , et al. April 13, 1 | 1993-04-13 |
| Transparent resin material Grant 5,164,469 - Goto , et al. November 17, 1 | 1992-11-17 |
| Process for producing methacrylic acid Grant 4,246,427 - Andoh , et al. January 20, 1 | 1981-01-20 |
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