Iino; Chie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iino; Chie.The latest application filed is for "bump base reinforcement sheet".

Company Profile

0.4.11

Iino; Chie - Ibaraki JP
Iino; Chie - Ibaraki-shi Osaka

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device Grant 10,128,131 - Shiga , et al. November 13, 2	2018-11-13
Bump Base Reinforcement Sheet App 20180304603 - Iino; Chie ; et al.	2018-10-25
Sealing sheet Grant 10,074,582 - Ishii , et al. September 11, 2	2018-09-11
Sealing Sheet App 20170287800 - Ishii; Jun ; et al.	2017-10-05
Sealing Sheet, Sealing Sheet With Separator, Semiconductor Device, And Production Method For Semiconductor Device App 20170278716 - Iino; Chie ; et al.	2017-09-28
Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing Grant 9,754,894 - Iino , et al. September 5, 2	2017-09-05
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package Grant 9,659,883 - Morita , et al. May 23, 2	2017-05-23
Method For Producing Semiconductor Package App 20170125373 - Morita; Kosuke ; et al.	2017-05-04
Electronic Component Device Production Method And Electronic Component Sealing Sheet App 20170040287 - Shiga; Goji ; et al.	2017-02-09
Sealing Sheet Provided With Double-sided Separator, And Method For Manufacturing Semiconductor Device App 20170040187 - Iino; Chie ; et al.	2017-02-09
Production Method For Semiconductor Package App 20170032979 - Morita; Kosuke ; et al.	2017-02-02
Production Method For Semiconductor Package App 20170033076 - Morita; Kosuke ; et al.	2017-02-02
Sealing Sheet With Separators On Both Surfaces, And Method For Manufacturing Semiconductor Device App 20160300733 - Shiga; Goji ; et al.	2016-10-13
Thermally Curable Resin Sheet For Sealing Semiconductor Chip, And Method For Manufacturing Semiconductor Package App 20160211228 - Morita; Kosuke ; et al.	2016-07-21
Sheet For Sealing And Method For Manufacturing Semiconductor Device Using Said Sheet For Sealing App 20160211217 - IINO; Chie ; et al.	2016-07-21

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.