Iimura; Seiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iimura; Seiji.The latest application filed is for "ozone-scavenging materials and processes for preparing them".
- Iimura; Seiji - Kanagawa JP
- Iimura; Seiji - Tokyo JP
| Patent | Date |
|---|---|
| Ozone removing material and method for preparing the same Grant 7,291,312 - Iimura , et al. November 6, 2 | 2007-11-06 |
| Copper plating bath and plating method for substrate using the copper plating bath Grant 6,800,188 - Hagiwara , et al. October 5, 2 | 2004-10-05 |
| Ozone-scavenging materials and processes for preparing them App 20040028575 - Iimura, Seiji ; et al. | 2004-02-12 |
| Copper plating bath and plating method for substrate using the copper plating bath App 20030106802 - Hagiwara, Hideki ; et al. | 2003-06-12 |
| Dioxo piperazine compounds Grant 4,316,024 - Iimura , et al. February 16, 1 | 1982-02-16 |
| 7-(Syn-.alpha.-alkoxy-iminofurylacetamido-3-(2-carboxyalkyl-2,3-dihy dro-s-triazolo[4,3-b]pyridazin-3-on-6-ylthiomethyl)-3-cephem-4-carboxylic acids Grant 4,103,085 - Naito , et al. July 25, 1 | 1978-07-25 |
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