Iijima; Tomoo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iijima; Tomoo.The latest application filed is for "multilayer wiring board for an electronic device".

Company Profile

1.19.24

Iijima; Tomoo - Kiryu JP
Iijima; Tomoo - Tokyo JP
IIJIMA; Tomoo - Kiryu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electric motor Grant 10,270,321 - Tamura , et al.	2019-04-23
Electric motor and electric pump Grant 10,128,720 - Ishizeki , et al. November 13, 2	2018-11-13
Multilayer wiring board for an electronic device Grant 10,104,785 - Iijima , et al. October 16, 2	2018-10-16
Multilayer Wiring Board For An Electronic Device App 20170171986 - Iijima; Tomoo ; et al.	2017-06-15
Electric Motor App 20170104395 - TAMURA; Natsumi ; et al.	2017-04-13
Multilayer wiring board for an electronic device Grant 9,521,755 - Iijima , et al. December 13, 2	2016-12-13
Electric Motor And Electric Pump App 20150357886 - Ishizeki; Masaki ; et al.	2015-12-10
Multilayer Wiring Board For An Electronic Device App 20140240934 - Iijima; Tomoo ; et al.	2014-08-28
Structure and method of making interconnect element having metal traces embedded in surface of dielectric Grant 8,736,064 - Kotake , et al. May 27, 2	2014-05-27
Multilayer Wiring Board For An Electronic Device App 20130247372 - Iijima; Tomoo ; et al.	2013-09-26
Method for manufacturing multilayer wiring board Grant 8,112,881 - Shimizu , et al. February 14, 2	2012-02-14
Structure And Method Of Making Interconnect Element Having Metal Traces Embedded In Surface Of Dielectric App 20110057324 - Kotake; Hideki ; et al.	2011-03-10
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module App 20100242270 - Iijima; Tomoo ; et al.	2010-09-30
Methods of making microelectronic assemblies Grant 7,721,422 - Iijima , et al. May 25, 2	2010-05-25
Manufacturing method for wiring circuit substrate Grant 7,546,681 - Iijima , et al. June 16, 2	2009-06-16
Multilayer wiring board for an electronic device Grant 7,505,281 - Iijima , et al. March 17, 2	2009-03-17
Multilayer wiring board for an electronic device App 20080296254 - Iijima; Tomoo ; et al.	2008-12-04
Structure and method of making interconnect element having metal traces embedded in surface of dielectric App 20080169568 - Kotake; Hideki ; et al.	2008-07-17
Structure and method of making interconnect element having metal traces embedded in surface of dielectric App 20080136041 - Kotake; Hideki ; et al.	2008-06-12
Method For Manufacturing Multilayer Wiring Board App 20080110018 - Shimizu; Kazuhiro ; et al.	2008-05-15
Multilayer wiring board for an electronic device Grant 7,342,802 - Iijima , et al. March 11, 2	2008-03-11
Methods of making microelectronic assemblies App 20070209199 - Iijima; Tomoo ; et al.	2007-09-13
Flexible Circuit Board, Method For Making The Same, Flexible Multi-layer Wiring Circuit Board, And Method For Making The Same App 20070170598 - Iijima; Tomoo ; et al.	2007-07-26
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate Grant 7,238,603 - Iijima , et al. July 3, 2	2007-07-03
Multilayer wiring board for an electronic device App 20070121305 - Iijima; Tomoo ; et al.	2007-05-31
Manufacturing method for wiring circuit substrate App 20060258139 - Iijima; Tomoo ; et al.	2006-11-16
Manufacturing method for wiring circuit substrate Grant 7,096,578 - Iijima , et al. August 29, 2	2006-08-29
Interlayer member used for producing multilayer wiring board and method of producing the same App 20050224256 - Osawa, Kenji ; et al.	2005-10-13
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate App 20050161804 - Iijima, Tomoo ; et al.	2005-07-28
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board App 20050097727 - Iijima, Tomoo ; et al.	2005-05-12
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate Grant 6,884,709 - Iijima , et al. April 26, 2	2005-04-26
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module App 20040201096 - Iijima, Tomoo ; et al.	2004-10-14
Manufacturing method for wiring circuit substrate App 20040197962 - Iijima, Tomoo ; et al.	2004-10-07
Method for fabricating a wiring substrate by electroplating a wiring film on a metal base Grant 6,782,610 - Iijima , et al. August 31, 2	2004-08-31
Wiring circuit substrate and manufacturing method therefor Grant 6,646,337 - Iijima , et al. November 11, 2	2003-11-11
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Grant 6,617,236 - Oosawa , et al. September 9, 2	2003-09-09
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate App 20030155653 - Iijima, Tomoo ; et al.	2003-08-21
Wiring circuit substrate and manufacturing method therefor App 20030151067 - Iijima, Tomoo ; et al.	2003-08-14
Wiring circuit substrate and manufacturing method therefor App 20030143833 - Iijima, Tomoo ; et al.	2003-07-31
Wiring circuit substrate and manufacturing method thereof Grant 6,528,874 - Iijima , et al. March 4, 2	2003-03-04
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device App 20020086514 - Oosawa, Kenji ; et al.	2002-07-04
Fabrication method of wiring substrate for mounting semiconductor element and semiconductor device Grant 6,372,620 - Oosawa , et al. April 16, 2	2002-04-16

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