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Patent applications and USPTO patent grants for Iijima; Kazuhiko.The latest application filed is for "wiring substrate and manufacturing method of wiring substrate".
Patent | Date |
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Wiring substrate and manufacturing method of wiring substrate Grant 10,109,571 - Fukui , et al. October 23, 2 | 2018-10-23 |
Wiring Substrate And Manufacturing Method Of Wiring Substrate App 20170103944 - FUKUI; Kei ;   et al. | 2017-04-13 |
Multilayer wiring circuit board Grant 7,671,281 - Kusagaya , et al. March 2, 2 | 2010-03-02 |
Multilayer wiring circuit board Grant 7,253,023 - Kusagaya , et al. August 7, 2 | 2007-08-07 |
Multilayer wiring circuit board App 20050098882 - Kusagaya, Toshihiro ;   et al. | 2005-05-12 |
Multi-layer wiring board and method of producing same Grant 6,812,412 - Obata , et al. November 2, 2 | 2004-11-02 |
Multi-layer wiring board and method of producing same App 20030098179 - Obata, Souichi ;   et al. | 2003-05-29 |
Multilayer wiring circuit board App 20030063453 - Kusagaya, Toshihiro ;   et al. | 2003-04-03 |
Multilayer printed circuit board and method of making the same App 20020108776 - Uchikawa, Katsumi ;   et al. | 2002-08-15 |
Automatic logic designing method and system Grant 5,504,690 - Kageyama , et al. April 2, 1 | 1996-04-02 |
Method and system for logic change in an automatic logic synthesis system Grant 5,331,569 - Iijima July 19, 1 | 1994-07-19 |
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