Iijima; Hiroyoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iijima; Hiroyoshi.The latest application filed is for "heat curable addition-reactive type silicone rubber composition".
- Iijima; Hiroyoshi - Tokyo JP
- Iijima; Hiroyoshi - Minato-ku JP
| Patent | Date |
|---|---|
| Heat curable silicone rubber composition Grant 9,487,639 - Tagai , et al. November 8, 2 | 2016-11-08 |
| Heat curable addition-reactive type silicone rubber composition Grant 9,487,656 - Iijima , et al. November 8, 2 | 2016-11-08 |
| Resin composition with high dielectric insulation properties Grant 9,343,196 - Matsukura , et al. May 17, 2 | 2016-05-17 |
| Heat Curable Addition-reactive Type Silicone Rubber Composition App 20150299398 - IIJIMA; Hiroyoshi ; et al. | 2015-10-22 |
| Heat Curable Silicone Rubber Composition App 20150291766 - Tagai; Hidefumi ; et al. | 2015-10-15 |
| Heat Curable Silicone Rubber Composition App 20150252238 - Takahashi; Hideo ; et al. | 2015-09-10 |
| Resin Composition With High Dielectric Insulation Properties App 20140296387 - Matsukura; Toshihiko ; et al. | 2014-10-02 |
| Heat-curable Silicone Rubber Composition App 20140275363 - IIJIMA; Hiroyoshi ; et al. | 2014-09-18 |
| Heat-curable silicone rubber composition Grant 8,779,072 - Iijima , et al. July 15, 2 | 2014-07-15 |
| Liquid Silicone Rubber Composition For High Voltage Insulation Parts App 20130225735 - Matsukura; Toshihiko ; et al. | 2013-08-29 |
| Heat curing silicone rubber compound composition Grant 8,030,378 - Iijima October 4, 2 | 2011-10-04 |
| Heat Curing Silicone Rubber Compound Composition App 20110118392 - Iijima; Hiroyoshi | 2011-05-19 |
| Heat Curing Silicone Rubber Composition App 20110039991 - Iijima; Hiroyoshi ; et al. | 2011-02-17 |
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