Iijima; Atsushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iijima; Atsushi.The latest application filed is for "golf club comprising golf club head".

Company Profile

10.149.109

Iijima; Atsushi - Hong Kong HK
IIJIMA; Atsushi - Tokyo JP
Iijima; Atsushi - Shatin HK
IIJIMA; Atsushi - Kofu JP
Iijima; Atsushi - Shatin, N.T. CN
IIJIMA; Atsushi - US
Iijima; Atsushi - US
Iijima; Atsushi - Saku JP
Iijima; Atsushi - Tokorozawa JP
Iijima, Atsushi - Saku City JP
Iijima, Atsushi - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thin-film piezoelectric-material element, method of manufacturing the same, head gimbal assembly and hard disk drive Grant 11,411,162 - Xiong , et al. August 9, 2	2022-08-09
Golf Club Comprising Golf Club Head App 20220241657 - KASAI; Takeshi ; et al.	2022-08-04
Thin-film Piezoelectric Material Element App 20220180896 - XIONG; Wei ; et al.	2022-06-09
Thin-film piezoelectric actuator Grant 11,292,255 - Xiong , et al. April 5, 2	2022-04-05
Thin-film piezoelectric material substrate, thin-film piezoelectric material element, head gimbal assembly, ink jet head and method of manufacturing the thin-film piezoelectric Grant 11,295,770 - Xiong , et al. April 5, 2	2022-04-05
Thin-film piezoelectric-material element, method of manufacturing the same, head gimbal assembly and hard disk drive Grant 11,289,641 - Xiong , et al. March 29, 2	2022-03-29
Magnetically Actuated Mems Switch App 20210313130 - KAMIJIMA; Akifumi ; et al.	2021-10-07
Magnetically actuated MEMS switch Grant 11,075,041 - Kamijima , et al. July 27, 2	2021-07-27
Semisolid electrolyte solution, semisolid electrolyte, semisolid electrolyte layer, electrode, and secondary battery Grant 11,063,298 - Ueda , et al. July 13, 2	2021-07-13
Method of manufacturing a capacitor including dielectric structure formed of sintered body Grant 11,056,282 - Sasaki , et al. July 6, 2	2021-07-06
Thin-film Piezoelectric Actuator App 20200189279 - XIONG; Wei ; et al.	2020-06-18
Semisolid Electrolyte Solution, Semisolid Electrolyte, Semisolid Electrolyte Layer, Electrode, and Secondary Battery App 20200119404 - UEDA; Suguru ; et al.	2020-04-16
Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film Grant 10,614,842 - Xiong , et al.	2020-04-07
Head gimbal assembly thin-film piezoelectric-material element arranged in step part configuration with protective films Grant 10,607,641 - Xiong , et al.	2020-03-31
Head Gimbal Assembly Thin-film Piezoelectric-material Element Arranged In Step Part Configuration With Protective Films App 20200091402 - Xiong; Wei ; et al.	2020-03-19
Thin-film Piezoelectric-material Element, Method of Manufacturing the Same, Head Gimbal Assembly and Hard Disk Drive App 20200091401 - Xiong; Wei ; et al.	2020-03-19
Thin-film Piezoelectric-material Element With Protective Film Composition And Insulating Film Through Hole Exposing Lower Electr App 20200091403 - Xiong; Wei ; et al.	2020-03-19
Thin-film Piezoelectric-material Element, Method of Manufacturing the Same, Head Gimbal Assembly and Hard Disk Drive App 20200091400 - Xiong; Wei ; et al.	2020-03-19
Semisolid Electrolyte Solution, Semisolid Electrolyte, Semisolid Electrolyte Layer, Electrode, and Secondary Battery App 20200014067 - UEDA; Suguru ; et al.	2020-01-09
Magnetically Actuated Mems Switch App 20190318893 - KAMIJIMA; Akifumi ; et al.	2019-10-17
Thin-film Piezoelectric Material Substrate, Thin-film Piezoelectric Material Element, Head Gimbal Assembly, Ink Jet Head And Met App 20190279670 - XIONG; Wei ; et al.	2019-09-12
Capacitor including dielectric structure formed of sintered body, and manufacturing method thereof Grant 10,283,274 - Sasaki , et al.	2019-05-07
Thin-film piezoelectric material substrate, thin-film piezoelectric material element, head gimbal assembly, ink jet head and method of manufacturing the thin-film piezoelectric material element Grant 10,276,196 - Xiong , et al.	2019-04-30
Method Of Manufacturing A Capacitor Including Dielectric Structure Formed Of Sintered Body App 20190035558 - SASAKI; Yoshitaka ; et al.	2019-01-31
Capacitor Including Dielectric Structure Formed Of Sintered Body, And Manufacturing Method Thereof App 20190019623 - SASAKI; Yoshitaka ; et al.	2019-01-17
Thin film piezoelectric element and manufacturing method thereof Grant 10,181,557 - Xiong , et al. Ja	2019-01-15
Thin Film Piezoelectric Element And Manufacturing Method Thereof App 20170317267 - XIONG; Wei ; et al.	2017-11-02
Magnetic head for perpendicular magnetic recording that includes a sensor for detecting contact with a recording medium Grant 9,773,514 - Sasaki , et al. September 26, 2	2017-09-26
Thin-film piezoelectric material element, head gimbal assembly and hard disk drive Grant 9,722,169 - Xiong , et al. August 1, 2	2017-08-01
Thin-film Piezoelectric Material Element, Head Gimbal Assembly And Hard Disk Drive App 20170207383 - XIONG; Wei ; et al.	2017-07-20
Memory device, laminated semiconductor substrate and method of manufacturing the same Grant 9,685,424 - Sasaki , et al. June 20, 2	2017-06-20
Thin-film Piezoelectric Material Substrate, Thin-film Piezoelectric Material Element, Head Gimbal Assembly, Ink Jet Head And Method Of Manufacturing The Thin-film Piezoelectric Material Element App 20170162779 - XIONG; Wei ; et al.	2017-06-08
Thin-film Piezoelectric Material Element, Head Gimbal Assembly And Hard Disk Drive App 20170133045 - XIONG; Wei ; et al.	2017-05-11
Thin-film piezoelectric material element, head gimbal assembly and hard disk drive Grant 9,646,637 - Xiong , et al. May 9, 2	2017-05-09
Electroacoustic Filter And Method Of Manufacturing An Electroacoustic Filter App 20160336918 - KNAUER; Ulrich ; et al.	2016-11-17
Thin film piezoelectric element and manufacturing method thereof, micro-actuator, head gimbal assembly and disk drive unit with the same Grant 9,450,171 - Xiong , et al. September 20, 2	2016-09-20
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,922,948 - Sasaki , et al. December 30, 2	2014-12-30
Manufacturing method for layered chip packages Grant 8,912,042 - Sasaki , et al. December 16, 2	2014-12-16
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,896,967 - Sasaki , et al. November 25, 2	2014-11-25
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,867,169 - Sasaki , et al. October 21, 2	2014-10-21
Surface acoustic wave device Grant 8,829,762 - Nakano , et al. September 9, 2	2014-09-09
Thin-film magnetic head with improved wide area track erasure (WATE), method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,824,102 - Sasaki , et al. September 2, 2	2014-09-02
Magnetic head for perpendicular magnetic recording with shield around main pole Grant 8,749,919 - Sasaki , et al. June 10, 2	2014-06-10
Memory Device, Laminated Semiconductor Substrate And Method Of Manufacturing The Same App 20140124959 - SASAKI; Yoshitaka ; et al.	2014-05-08
Combination for composite layered chip package Grant 8,710,641 - Sasaki , et al. April 29, 2	2014-04-29
Manufacturing Method For Layered Chip Packages App 20140080259 - Sasaki; Yoshitaka ; et al.	2014-03-20
Memory device, laminated semiconductor substrate and method of manufacturing the same Grant 8,659,166 - Sasaki , et al. February 25, 2	2014-02-25
Layered chip package and method of manufacturing same Grant 8,653,639 - Sasaki , et al. February 18, 2	2014-02-18
Method of manufacturing layered chip package Grant 8,652,877 - Sasaki , et al. February 18, 2	2014-02-18
Layered chip package and method of manufacturing same Grant 8,618,646 - Sasaki , et al. December 31, 2	2013-12-31
Magnetic Head For Perpendicular Magnetic Recording Having A Main Pole And A Shield App 20130308227 - SASAKI; Yoshitaka ; et al.	2013-11-21
Method of manufacturing layered chip package Grant 8,587,125 - Sasaki , et al. November 19, 2	2013-11-19
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,576,514 - Sasaki , et al. November 5, 2	2013-11-05
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Grant 8,569,878 - Sasaki , et al. October 29, 2	2013-10-29
Thin Film Piezoelectric Element And Manufacturing Method Thereof, Micro-actuator, Head Gimbal Assembly And Disk Drive Unit With The Same App 20130279044 - XIONG; Wei ; et al.	2013-10-24
Thin Film Piezoelectric Element And Manufacturing Method Thereof, Micro-actuator, Head Gimbal Assembly And Disk Drive Unit With The Same App 20130279042 - XIONG; Wei ; et al.	2013-10-24
Laminated semiconductor substrate, semiconductor substrate, laminated chip package and method of manufacturing the same Grant 8,552,534 - Sasaki , et al. October 8, 2	2013-10-08
Layered chip package and method of manufacturing same Grant 8,541,887 - Sasaki , et al. September 24, 2	2013-09-24
Combination For Composite Layered Chip Package App 20130241081 - SASAKI; Yoshitaka ; et al.	2013-09-19
Memory device and method of manufacturing the same Grant 8,536,712 - Sasaki , et al. September 17, 2	2013-09-17
Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package Grant 8,525,167 - Sasaki , et al. September 3, 2	2013-09-03
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,514,516 - Sasaki , et al. August 20, 2	2013-08-20
Perpendicular magnetic recording head including a front shield part and the method of manufacturing the same Grant 8,514,520 - Sasaki , et al. August 20, 2	2013-08-20
Method of manufacturing a thin-film magnetic head Grant 8,499,435 - Sasaki , et al. August 6, 2	2013-08-06
Magnetic head for perpendicular magnetic recording that includes a sensor for detecting contact with a recording medium Grant 8,498,080 - Sasaki , et al. July 30, 2	2013-07-30
Magnetic head for perpendicular magnetic recording with shield around main pole Grant 8,493,687 - Sasaki , et al. July 23, 2	2013-07-23
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20130176644 - SASAKI; Yoshitaka ; et al.	2013-07-11
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Grant 8,482,105 - Sasaki , et al. July 9, 2	2013-07-09
Magnetic head for perpendicular magnetic recording having a tapered main pole Grant 8,477,452 - Sasaki , et al. July 2, 2	2013-07-02
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20130155550 - Sasaki; Yoshitaka ; et al.	2013-06-20
Layered chip package Grant 8,466,562 - Sasaki , et al. June 18, 2	2013-06-18
Ceramic capacitor and method of manufacturing same Grant 8,462,482 - Sasaki , et al. June 11, 2	2013-06-11
Layered chip package and method of manufacturing same Grant 8,455,349 - Sasaki , et al. June 4, 2	2013-06-04
Magnetic head for perpendicular magnetic recording having a main pole, a shield and a coil core part setback away from the medium facing surface a specified distance Grant 8,441,755 - Sasaki , et al. May 14, 2	2013-05-14
Method of manufacturing layered chip package Grant 8,441,112 - Sasaki , et al. May 14, 2	2013-05-14
Laminated Semiconductor Substrate, Semiconductor Substrate, Laminated Chip Package And Method Of Manufacturing The Same App 20130105949 - SASAKI; Yoshitaka ; et al.	2013-05-02
Ceramic capacitor and method of manufacturing same Grant 8,432,662 - Sasaki , et al. April 30, 2	2013-04-30
Method Of Manufacturing The Thin-film Magnetic Head, The Thin-film Magnetic Head, Head Gimbal Assembly And Hard Disk Drive App 20130100555 - SASAKI; Yoshitaka ; et al.	2013-04-25
Composite layered chip package Grant 8,426,981 - Sasaki , et al. April 23, 2	2013-04-23
Composite layered chip package Grant 8,426,979 - Sasaki , et al. April 23, 2	2013-04-23
Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Grant 8,426,948 - Sasaki , et al. April 23, 2	2013-04-23
Laminated semiconductor wafer, laminated chip package and method of manufacturing the same Grant 8,426,947 - Sasaki , et al. April 23, 2	2013-04-23
Laminated semiconductor substrate, laminated chip package and method of manufacturing the same Grant 8,426,946 - Sasaki , et al. April 23, 2	2013-04-23
Layered chip package and method of manufacturing same Grant 8,421,243 - Sasaki , et al. April 16, 2	2013-04-16
Magnetic head for perpendicular magnetic recording having a return path section Grant 8,416,528 - Sasaki , et al. April 9, 2	2013-04-09
Composite Layered Chip Package App 20130075935 - SASAKI; Yoshitaka ; et al.	2013-03-28
Thermally assisted magnetic head, head gimbal assembly, and hard disk drive Grant 8,395,972 - Sasaki , et al. March 12, 2	2013-03-12
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20130057987 - Sasaki; Yoshitaka ; et al.	2013-03-07
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,390,955 - Sasaki , et al. March 5, 2	2013-03-05
Magnetic Head For Perpendicular Magnetic Recordinghaving A Main Pole, A Shield And A Coil Core Part Setback Away From The Medium Facing Surface A Specified Distance App 20130038966 - Sasaki; Yoshitaka ; et al.	2013-02-14
Layered chip package and method of manufacturing same Grant 8,362,602 - Sasaki , et al. January 29, 2	2013-01-29
Composite Layered Chip Package App 20130020723 - SASAKI; Yoshitaka ; et al.	2013-01-24
Layered chip package and method of manufacturing same Grant 8,358,015 - Sasaki , et al. January 22, 2	2013-01-22
Thin-film magnetic head having coil of varying thinknesses in spaces adjacent the main magnetic pole Grant 8,358,487 - Sasaki , et al. January 22, 2	2013-01-22
Magnetic head for perpendicular magnetic recording having a main pole and a shield and specifically structured and located coil elements and magnetic coupling layers Grant 8,345,382 - Sasaki , et al. January 1, 2	2013-01-01
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,345,384 - Sasaki , et al. January 1, 2	2013-01-01
Layered chip package and method of manufacturing same Grant 8,344,494 - Sasaki , et al. January 1, 2	2013-01-01
Layered Chip Package And Method Of Manufacturing Same App 20120313260 - SASAKI; Yoshitaka ; et al.	2012-12-13
Layered Chip Package And Method Of Manufacturing Same App 20120313259 - SASAKI; Yoshitaka ; et al.	2012-12-13
Magnetic Head For Perpendicular Magnetic Recordinghaving A Main Pole And A Shield And Specifically Structured And Located Coil Elements And Magnetic Coupling Layers App 20120314323 - SASAKI; Yoshitaka ; et al.	2012-12-13
Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,325,441 - Sasaki , et al. December 4, 2	2012-12-04
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,310,787 - Sasaki , et al. November 13, 2	2012-11-13
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20120282492 - SASAKI; Yoshitaka ; et al.	2012-11-08
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,300,357 - Sasaki , et al. October 30, 2	2012-10-30
Method of manufacturing layered chip package Grant 8,298,862 - Sasaki , et al. October 30, 2	2012-10-30
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,295,008 - Sasaki , et al. October 23, 2	2012-10-23
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20120262825 - SASAKI; Yoshitaka ; et al.	2012-10-18
Magnetic Head For Perpendicular Magnetic Recording Having A Main Pole And A Shield App 20120257304 - SASAKI; Yoshitaka ; et al.	2012-10-11
Layered Chip Package And Method Of Manufacturing Same App 20120256321 - SASAKI; Yoshitaka ; et al.	2012-10-11
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Grant 8,274,165 - Sasaki , et al. September 25, 2	2012-09-25
Magnetic head for perpendicular magnetic recording having a main pole and a shield Grant 8,274,759 - Sasaki , et al. September 25, 2	2012-09-25
Magnetic Head For Perpendicular Magnetic Recording That Includes A Sensor For Detecting Contact With A Recording Medium App 20120218663 - SASAKI; Yoshitaka ; et al.	2012-08-30
Magnetic Head For Perpendicular Magnetic Recording That Includes A Sensor For Detecting Contact With A Recording Medium App 20120218662 - SASAKI; Yoshitaka ; et al.	2012-08-30
Layered chip package and method of manufacturing the same Grant 8,253,257 - Sasaki , et al. August 28, 2	2012-08-28
Thermally-assisted magnetic recording head having heat radiation layer and interposed layer Grant 8,248,894 - Sasaki , et al. August 21, 2	2012-08-21
Layered Chip Package And Method Of Manufacturing The Same App 20120187575 - SASAKI; Yoshitaka ; et al.	2012-07-26
Magnetic Head For Perpendicular Magnetic Recording Having A Main Pole And A Shield App 20120188666 - SASAKI; Yoshitaka ; et al.	2012-07-26
Memory Device And Method Of Manufacturing The Same App 20120187574 - SASAKI; Yoshitaka ; et al.	2012-07-26
Magnetic head for perpendicular magnetic recording having a main pole and two shields Grant 8,218,264 - Sasaki , et al. July 10, 2	2012-07-10
Magnetic Head For Perpendicular Magnetic Recording Having A Main Pole And Two Shields App 20120170156 - SASAKI; Yoshitaka ; et al.	2012-07-05
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20120170154 - SASAKI; Yoshitaka ; et al.	2012-07-05
Layered chip package and method of manufacturing same Grant 8,203,216 - Sasaki , et al. June 19, 2	2012-06-19
Layered chip package and method of manufacturing same Grant 8,203,215 - Sasaki , et al. June 19, 2	2012-06-19
Magnetic Head For Perpendicular Magnetic Recording With Shield Around Main Pole App 20120147501 - SASAKI; Yoshitaka ; et al.	2012-06-14
Magnetic Head For Perpendicular Magnetic Recording With Shield Around Main Pole App 20120147499 - SASAKI; Yoshitaka ; et al.	2012-06-14
Magnetic Head For Perpendicular Magnetic Recording Having A Tapered Main Pole App 20120147500 - SASAKI; Yoshitaka ; et al.	2012-06-14
Method Of Manufacturing Layered Chip Package App 20120142146 - SASAKI; Yoshitaka ; et al.	2012-06-07
Heat-assisted magnetic recording head with near-field light generating element Grant 8,194,510 - Sasaki , et al. June 5, 2	2012-06-05
Heat-assisted magnetic recording head with near-field light generating element Grant 8,194,511 - Sasaki , et al. June 5, 2	2012-06-05
Memory Device, Laminated Semiconductor Substrate And Method Of Manufacturing The Same App 20120126427 - SASAKI; Yoshitaka ; et al.	2012-05-24
Method of manufacturing ceramic capacitor Grant 8,171,607 - Sasaki , et al. May 8, 2	2012-05-08
Thermally Assisted Magnetic Head, Head Gimbal Assembly, And Hard Disk Drive App 20120087217 - SASAKI; Yoshitaka ; et al.	2012-04-12
Layered Chip Package And Method Of Manufacturing Same App 20120086130 - SASAKI; Yoshitaka ; et al.	2012-04-12
Method Of Manufacturing Layered Chip Package App 20120080782 - SASAKI; Yoshitaka ; et al.	2012-04-05
Layered Chip Package And Method Of Manufacturing Same App 20120056333 - SASAKI; Yoshitaka ; et al.	2012-03-08
Layered Chip Package And Method Of Manufacturing Same App 20120032318 - Sasaki; Yoshitaka ; et al.	2012-02-09
Laminated Semiconductor Substrate, Laminated Chip Package And Method Of Manufacturing The Same App 20120025355 - SASAKI; Yoshitaka ; et al.	2012-02-02
Laminated Semiconductor Substrate, Laminated Chip Package And Method Of Manufacturing The Same App 20120025354 - SASAKI; YOSHITAKA ; et al.	2012-02-02
Heat-assisted magnetic recording head with laser diode fixed to slider Grant 8,107,192 - Sasaki , et al. January 31, 2	2012-01-31
Layered Chip Package and Method of Manufacturing Same App 20120013025 - Sasaki; Yoshitaka ; et al.	2012-01-19
Layered Chip Package and Method of Manufacturing Same App 20120013024 - SASAKI; Yoshitaka ; et al.	2012-01-19
Layered Chip Package And Method Of Manufacturing Same App 20110316141 - Sasaki; Yoshitaka ; et al.	2011-12-29
Laminated semiconductor substrate, laminated chip package and method of manufacturing the same App 20110316123 - Sasaki; Yoshitaka ; et al.	2011-12-29
Thin-film magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive Grant 8,077,433 - Sasaki , et al. December 13, 2	2011-12-13
Method of manufacturing a thermally assisted magnetic head Grant 8,065,787 - Sasaki , et al. November 29, 2	2011-11-29
Layered Chip Package And Method Of Manufacturing Same App 20110266692 - SASAKI; Yoshitaka ; et al.	2011-11-03
Surface acoustic wave device App 20110241480 - Nakano; Masahiro ; et al.	2011-10-06
Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive App 20110242703 - Sasaki; Yoshitaka ; et al.	2011-10-06
A Method Of Manufacturing A Thermally Assisted Magnetic Head App 20110228416 - Sasaki; Yoshitaka ; et al.	2011-09-22
Heat-assisted Magnetic Recording Head With Near-field Light Generating Element App 20110228417 - Sasaki; Yoshitaka ; et al.	2011-09-22
Heat-assisted Magnetic Recording Head With Near-field Light Generating Element App 20110228418 - Sasaki; Yoshitaka ; et al.	2011-09-22
Method of manufacturing layered chip package Grant 8,012,802 - Sasaki , et al. September 6, 2	2011-09-06
Method Of Manufacturing Layered Chip Package App 20110189820 - SASAKI; Yoshitaka ; et al.	2011-08-04
Method Of Manufacturing Layered Chip Package App 20110189822 - SASAKI; Yoshitaka ; et al.	2011-08-04
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same App 20110186985 - Sasaki; Yoshitaka ; et al.	2011-08-04
Method Of Manufacturing Layered Chip Package App 20110180932 - SASAKI; Yoshitaka ; et al.	2011-07-28
Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive App 20110164333 - Sasaki; Yoshitaka ; et al.	2011-07-07
Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package App 20110095289 - Sasaki; Yoshitaka ; et al.	2011-04-28
Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same App 20110095414 - Sasaki; Yoshitaka ; et al.	2011-04-28
Heat-assisted magnetic recording head with laser diode fixed to slider App 20110096435 - Sasaki; Yoshitaka ; et al.	2011-04-28
Method of manufacturing layered chip package Grant 7,915,083 - Sasaki , et al. March 29, 2	2011-03-29
Method of manufacturing layered chip package Grant 7,915,079 - Sasaki , et al. March 29, 2	2011-03-29
Layered chip package and method of manufacturing same App 20110068456 - Sasaki; Yoshitaka ; et al.	2011-03-24
Composite layered chip package and method of manufacturing same Grant 7,902,677 - Sasaki , et al. March 8, 2	2011-03-08
Semiconductor Substrate, Laminated Chip Package, Semiconductor Plate And Method Of Manufacturing The Same App 20100200959 - SASAKI; Yoshitaka ; et al.	2010-08-12
Method Of Manufacturing Ceramic Capacitor App 20100192343 - Sasaki; Yoshitaka ; et al.	2010-08-05
Ceramic Capacitor And Method Of Manufacturing Same App 20100195262 - SASAKI; Yoshitaka ; et al.	2010-08-05
Ceramic Capacitor And Method Of Manufacturing Same App 20100195264 - Sasaki; Yoshitaka ; et al.	2010-08-05
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20090296275 - SASAKI; Yoshitaka ; et al.	2009-12-03
Thin-film Magnetic Head, Method Of Manufacturing The Same, Head Gimbal Assembly, And Hard Disk Drive App 20090279207 - Sasaki; Yoshitaka ; et al.	2009-11-12
Method for manufacturing thin film magnetic head with improved performance Grant 7,120,990 - Sasaki , et al. October 17, 2	2006-10-17
Iron head for a golf club Grant 7,115,048 - Kusumoto , et al. October 3, 2	2006-10-03
Method of manufacturing thin film magnetic head Grant 7,067,066 - Sasaki , et al. June 27, 2	2006-06-27
Thin film magnetic head having thin film coil embedded in first insulating layer covered with second insulating layer Grant 7,061,718 - Sasaki , et al. June 13, 2	2006-06-13
Method of manufacturing the thin film magnetic head Grant 6,952,866 - Yoshida , et al. October 11, 2	2005-10-11
Method for manufacturing thin film magnetic head with improved performance App 20050044693 - Sasaki, Yoshitaka ; et al.	2005-03-03
Method of manufacturing thin film magnetic head with improved performance Grant 6,810,578 - Sasaki , et al. November 2, 2	2004-11-02
Thin film magnetic head and method of manufacturing the same Grant 6,724,570 - Yoshida , et al. April 20, 2	2004-04-20
Thin film magnetic head and method of manufacturing the same App 20040068861 - Yoshida, Makoto ; et al.	2004-04-15
Method of manufacturing thin film magnetic head App 20040069741 - Sasaki, Yoshitaka ; et al.	2004-04-15
Thin film magnetic head and method of manufacturing the same App 20040008447 - Sasaki, Yoshitaka ; et al.	2004-01-15
Thin film magnetic head recessed partially into substrate and including planarization layers Grant 6,671,135 - Sasaki , et al. December 30, 2	2003-12-30
Method of manufacturing thin film magnetic head Grant 6,669,855 - Sasaki , et al. December 30, 2	2003-12-30
Thin film magnetic head and method of manufacturing the same Grant 6,665,142 - Yoshida , et al. December 16, 2	2003-12-16
Thin film magnetic head recessed partially into substrate and including plantarization layers App 20030193743 - Sasaki, Yoshitaka ; et al.	2003-10-16
Method of manufacturing a thin film magnetic head Grant 6,609,291 - Sasaki , et al. August 26, 2	2003-08-26
Golf club head App 20030114245 - Kusumoto, Harunobu ; et al.	2003-06-19
Thin-film magnetic head having reduced yoke length and method of manufacturing same Grant 6,577,475 - Sasaki , et al. June 10, 2	2003-06-10
Thin film magnetic head with recess for positional reference Grant 6,490,130 - Sasaki , et al. December 3, 2	2002-12-03
Thin-film magnetic head and method of manufacturing same Grant 6,469,876 - Sasaki , et al. October 22, 2	2002-10-22
Thin Film Magnetic Head Recessed Partially Into Substrate And Including Plantarization Layersi App 20020067570 - SASAKI, YOSHITAKA ; et al.	2002-06-06
Thin-film magnetic head and method of manufacturing same Grant 6,400,525 - Sasaki , et al. June 4, 2	2002-06-04
Thin-film Magnetic Head And Method Of Manufacturing Same App 20020048115 - Sasaki, Yoshitaka ; et al.	2002-04-25
Thin film mangetic head and method of manufacturing same Grant 6,353,995 - Sasaki , et al. March 12, 2	2002-03-12
Thin film magnetic head and method of manufacturing the same App 20010040762 - Yoshida, Makoto ; et al.	2001-11-15
Thin film magnetic head and method of manufacturing the same App 20010030831 - Yoshida, Makoto ; et al.	2001-10-18
Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head App 20010029158 - Sasaki, Yoshitaka ; et al.	2001-10-11
Thin film magnetic head and method of manufacturing the same App 20010012184 - Sasaki, Yoshitaka ; et al.	2001-08-09
Method of manufacturing thin film magnetic head App 20010012541 - Sasaki, Yoshitaka ; et al.	2001-08-09
Thin film magnet head with improved performance Grant 6,163,436 - Sasaki , et al. December 19, 2	2000-12-19
Thin film magnetic head having upper pole chip formed over insulating layer Grant 6,130,805 - Sasaki , et al. October 10, 2	2000-10-10