Iida; Hidekazu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iida; Hidekazu.The latest application filed is for "processing method of wafer".
- Iida; Hidekazu - Tokyo JP
- Iida; Hidekazu - Imadate JP
| Patent | Date |
|---|---|
| Processing method of wafer Grant 11,456,213 - Nishida , et al. September 27, 2 | 2022-09-27 |
| Method of processing a wafer Grant 10,957,593 - Nishida , et al. March 23, 2 | 2021-03-23 |
| Processing Method Of Wafer App 20210082763 - NISHIDA; Yoshiteru ; et al. | 2021-03-18 |
| Electrostatic chuck Grant 10,896,836 - Chito , et al. January 19, 2 | 2021-01-19 |
| Wafer processing method Grant 10,790,193 - Nishida , et al. September 29, 2 | 2020-09-29 |
| Wafer processing method Grant 10,790,192 - Nishida , et al. September 29, 2 | 2020-09-29 |
| Method Of Processing A Wafer App 20200176313 - NISHIDA; Yoshiteru ; et al. | 2020-06-04 |
| Wafer Processing Method App 20190311951 - NISHIDA; Yoshiteru ; et al. | 2019-10-10 |
| Wafer Processing Method App 20190311952 - NISHIDA; Yoshiteru ; et al. | 2019-10-10 |
| Electrostatic Chuck App 20190019712 - Chito; Kenta ; et al. | 2019-01-17 |
| Decompression processing apparatus Grant 10,175,588 - Iida J | 2019-01-08 |
| Decompression Processing Apparatus App 20180143544 - Iida; Hidekazu | 2018-05-24 |
| Etching method Grant 9,812,292 - Iida November 7, 2 | 2017-11-07 |
| Decompression Processing Apparatus App 20160276199 - Iida; Hidekazu | 2016-09-22 |
| Etching Method App 20160260624 - Iida; Hidekazu | 2016-09-08 |
| Silicone-based fabric finishing agent Grant 4,987,180 - Ohata , et al. January 22, 1 | 1991-01-22 |
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