IHMS; David W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for IHMS; David W..The latest application filed is for "electronic power package and heat sink/cold rail arrangement".

Company Profile

2.12.9

IHMS; David W. - Russiaville IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Power Package And Heat Sink/cold Rail Arrangement App 20220068753 - PAN; Binghua ; et al.	2022-03-03
Conformal Coating Blockage By Surface-mount Technology Solder Features App 20200315030 - Ihms; David W.	2020-10-01
Ceramic-wound-capacitor With Lead Lanthanum Zirconium Titanate Dielectric App 20190172649 - Fairchild; Manuel R. ; et al.	2019-06-06
Ceramic-wound-capacitor with lead lanthanum zirconium titanate dielectric Grant 10,163,572 - Fairchild , et al. Dec	2018-12-25
Electrical-device adhesive barrier Grant 9,978,707 - Zimmerman , et al. May 22, 2	2018-05-22
Ceramic-wound-capacitor With Lead Lanthanum Zirconium Titanate Dielectric App 20170301472 - Fairchild; Manuel Ray ; et al.	2017-10-19
Heat exchanger equipped with thermal electric device for engine exhaust carbon dioxide collection system Grant 9,267,415 - Myers , et al. February 23, 2	2016-02-23
Carbon dioxide absorbent fluid for a carbon dioxide sequestering system on a vehicle Grant 8,696,804 - Ihms , et al. April 15, 2	2014-04-15
Carbon Dioxide Absorbent Fluid For A Carbon Dioxide Sequestering System On A Vehicle App 20130220130 - IHMS; DAVID W. ; et al.	2013-08-29
Heat Exchanger Equipped With Thermal Electric Device For Engine Exhaust Carbon Dioxide Collection System App 20130186075 - MYERS; BRUCE A. ; et al.	2013-07-25
Vehicle system to separate and store carbon dioxide from engine exhaust Grant 8,480,798 - Myers , et al. July 9, 2	2013-07-09
Process for attaching components with near-zero standoff to printed circuit boards Grant 7,918,381 - Witty , et al. April 5, 2	2011-04-05
Process for attaching components with near-zero standoff to printed circuit boards App 20070119910 - Witty; Michael R. ; et al.	2007-05-31
Method of fabricating an electronic package having underfill standoff Grant 7,118,940 - Myers , et al. October 10, 2	2006-10-10
Enhancement of underfill physical properties by the addition of thermotropic cellulose Grant 7,119,449 - Workman , et al. October 10, 2	2006-10-10
Circuit board with localized stiffener for enhanced circuit component reliability Grant 7,094,975 - Chengalva , et al. August 22, 2	2006-08-22
Method of attaching a flip chip device and circuit assembly formed thereby Grant 7,038,321 - Chavan , et al. May 2, 2	2006-05-02
Enhancement of underfill physical properties by the addition of a thermotropic cellulose App 20050122697 - Workman, Derek B. ; et al.	2005-06-09
Circuit board with localized stiffener for enhanced circuit component reliability App 20050109534 - Chengalva, Suresh K. ; et al.	2005-05-26
Photo-feedback drive system Grant 5,089,748 - Ihms February 18, 1	1992-02-18

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