Ihara; Yoshihiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ihara; Yoshihiro.The latest application filed is for "semiconductor device and semiconductor device array".

Company Profile

4.27.24

Ihara; Yoshihiro - Nagano JP
IHARA; Yoshihiro - Nagano-shi JP
Ihara; Yoshihiro - Nagano-Ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and semiconductor device array Grant 11,322,478 - Yamano , et al. May 3, 2	2022-05-03
Folded substrate for stacked integrated circuit devices Grant 11,309,224 - Horikawa , et al. April 19, 2	2022-04-19
Semiconductor Device And Semiconductor Device Array App 20200365556 - YAMANO; Takaharu ; et al.	2020-11-19
Bioelectrode component Grant 10,588,533 - Sakaguchi , et al.	2020-03-17
Semiconductor Device App 20190198411 - HORIKAWA; Yasuyoshi ; et al.	2019-06-27
Battery and method for producing the same Grant 10,319,963 - Kubota , et al.	2019-06-11
Bioelectrode Component App 20190143091 - Sakaguchi; Hideaki ; et al.	2019-05-16
Circuit board module Grant 10,257,934 - Mori , et al.	2019-04-09
Sensor including a peelable insulation sheet Grant 10,219,745 - Konno , et al.	2019-03-05
Circuit Board Module App 20180317321 - MORI; Kenichi ; et al.	2018-11-01
Semiconductor device, heat conductor, and method for manufacturing semiconductor device Grant 9,716,053 - Murayama , et al. July 25, 2	2017-07-25
Sensor App 20170027516 - Konno; Norihito ; et al.	2017-02-02
Semiconductor device including semiconductor chips stacked via relay substrate Grant 9,508,670 - Hara , et al. November 29, 2	2016-11-29
Semiconductor device Grant 9,245,856 - Fujii , et al. January 26, 2	2016-01-26
Semiconductor Device, Heat Conductor, And Method For Manufacturing Semiconductor Device App 20150327397 - Murayama; Kei ; et al.	2015-11-12
Semiconductor Package App 20150262957 - Ihara; Yoshihiro	2015-09-17
Semiconductor Device App 20150221599 - Fujii; Tomoharu ; et al.	2015-08-06
Semiconductor Device App 20150130053 - HARA; Koji ; et al.	2015-05-14
Battery And Method For Producing The Same App 20140370365 - KUBOTA; Kazuyuki ; et al.	2014-12-18
Socket and semiconductor device provided with socket Grant 8,827,730 - Ihara September 9, 2	2014-09-09
Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate Grant 8,784,118 - Ihara July 22, 2	2014-07-22
Substrate having leads Grant 8,735,737 - Ihara , et al. May 27, 2	2014-05-27
Socket and method of fabricating the same Grant 8,419,442 - Horikawa , et al. April 16, 2	2013-04-16
Substrate With Spring Terminal And Method Of Manufacturing The Same App 20130048359 - IHARA; Yoshihiro	2013-02-28
Connection Terminal Structure, Method For Manufacturing Connection Terminal Structure, And Connection Terminal Structure Substrate App 20130029538 - IHARA; Yoshihiro	2013-01-31
Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure Grant 8,294,253 - Ihara October 23, 2	2012-10-23
Socket And Semiconductor Device Provided With Socket App 20120149249 - Ihara; Yoshihiro	2012-06-14
Board having connection terminal Grant 8,179,692 - Ihara May 15, 2	2012-05-15
Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board Grant 8,152,535 - Ihara April 10, 2	2012-04-10
Socket And Method Of Fabricating The Same App 20120021625 - Horikawa; Yasuyoshi ; et al.	2012-01-26
Socket Grant 8,083,529 - Ihara December 27, 2	2011-12-27
Socket App 20110300746 - IHARA; Yoshihiro	2011-12-08
Socket App 20110287671 - IHARA; Yoshihiro	2011-11-24
Board with connection terminals Grant 7,972,149 - Ihara July 5, 2	2011-07-05
Board With Connection Terminals App 20110053392 - IHARA; Yoshihiro	2011-03-03
Board Having Connection Terminal App 20110003492 - IHARA; Yoshihiro	2011-01-06
Substrate Having Leads App 20100300742 - Ihara; Yoshihiro ; et al.	2010-12-02
Semiconductor Device, Electronic Device And Method Of Manufacturing Semiconductor Device App 20100230823 - Ihara; Yoshihiro	2010-09-16
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device Grant 7,220,657 - Ihara , et al. May 22, 2	2007-05-22
Semiconductor device and manufacturing method therefor Grant 6,667,235 - Ihara December 23, 2	2003-12-23
Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device App 20030096495 - Ihara, Yoshihiro ; et al.	2003-05-22
Method of forming bumps by electroplating Grant 6,413,404 - Ihara , et al. July 2, 2	2002-07-02
Semiconductor device and manufacturing method therefor App 20010004133 - Ihara, Yoshihiro	2001-06-21
Film capacitor and semiconductor package or device carrying same Grant 6,184,567 - Fujisawa , et al. February 6, 2	2001-02-06
Device for forming bumps by metal plating Grant 6,030,512 - Ihara , et al. February 29, 2	2000-02-29

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