IGUCHI; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for IGUCHI; Hiroyuki.The latest application filed is for "adhesive composition for flexible printed-wiring board (fpc), and heat-curable resin film, prepreg and fpc substrate containing same".

Company Profile

14.12.20

IGUCHI; Hiroyuki - Annaka-shi JP
Iguchi; Hiroyuki - Annaka JP
Iguchi; Hiroyuki - Okazaki JP
Iguchi, Hiroyuki - Okazaki-shi JP
Iguchi; Hiroyuki - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive Composition For Flexible Printed-wiring Board (fpc), And Heat-curable Resin Film, Prepreg And Fpc Substrate Containing Same App 20220306920 - TSUURA; Atsushi ; et al.	2022-09-29
Maleimide Resin Film And Composition For Maleimide Resin Film App 20220267526 - IGUCHI; Hiroyuki ; et al.	2022-08-25
Cyclic Imide Resin Composition, Prepreg, Copper-clad Laminate And Printed-wiring Board App 20220195189 - IGUCHI; Hiroyuki ; et al.	2022-06-23
Radiation curable organosilicon resin composition Grant 11,326,056 - Iguchi , et al. May 10, 2	2022-05-10
Slurry composition, cured product of the slurry composition, and substrate, film and prepreg using the cured product Grant 11,267,966 - Tsutsumi , et al. March 8, 2	2022-03-08
Maleimide Resin Composition And Maleimide Resin Film App 20210079219 - IGUCHI; Hiroyuki ; et al.	2021-03-18
Maleimide Resin Film And Composition For Maleimide Resin Film App 20210061955 - IGUCHI; Hiroyuki ; et al.	2021-03-04
Heat-curable Resin Composition, And Adhesive Agent, Film, Prepreg, Laminate, Circuit Board And Printed-wiring Board Using Same App 20210054152 - TSUTSUMI; Yoshihiro ; et al.	2021-02-25
Aromatic Bismaleimide Compound, Production Method Thereof, And Heat-curable Cyclic Imide Resin Composition Containing The Compound App 20210017337 - TSUTSUMI; Yoshihiro ; et al.	2021-01-21
Adhesive substrate, transfer device having adhesive substrate, and method for producing adhesive substrate Grant 10,818,618 - Iguchi , et al. October 27, 2	2020-10-27
Low-dielectric Heat Dissipation Film Composition And Low-dielectric Heat Dissipation Film App 20200325334 - IGUCHI; Hiroyuki ; et al.	2020-10-15
Slurry Composition, Cured Product Of The Slurry Composition, And Substrate, Film And Prepreg Using The Cured Product App 20200317916 - TSUTSUMI; Yoshihiro ; et al.	2020-10-08
Addition-curable silicone resin composition and a semiconductor device Grant 10,696,794 - Iguchi , et al. June 30, 2	2020-06-30
Anisotropic Film And Method For Manufacturing Anisotropic Film App 20200156291 - IGUCHI; Hiroyuki ; et al.	2020-05-21
(meth)acryloyl Group-containing Organosiloxane App 20200131316 - IGUCHI; Hiroyuki	2020-04-30
Radiation Curable Organosilicon Resin Composition App 20200131367 - IGUCHI; Hiroyuki ; et al.	2020-04-30
Addition-curable organopolysiloxane resin composition, cured product thereof, and semiconductor device having the cured product Grant 10,556,993 - Mizunashi , et al. Feb	2020-02-11
Adhesive Substrate, Transfer Device Having Adhesive Substrate, And Method For Producing Adhesive Substrate App 20200035627 - IGUCHI; Hiroyuki ; et al.	2020-01-30
Addition-curable silicone resin composition and a semiconductor device Grant 10,253,139 - Iguchi , et al.	2019-04-09
Anisotropic Conductive Film And Method For Manufacturing Anisotropic Conductive Film App 20190100663 - IGUCHI; Hiroyuki ; et al.	2019-04-04
Addition-curable Silicone Resin Composition And A Semiconductor Device App 20190092905 - IGUCHI; Hiroyuki ; et al.	2019-03-28
Addition-curable Organopolysiloxane Resin Composition, Cured Product Thereof, And Semiconductor Device Having The Cured Product App 20180258227 - MIZUNASHI; Tomoyuki ; et al.	2018-09-13
Adhesion promoter, addition curable organopolysiloxane resin composition and semiconductor apparatus Grant 10,040,924 - Mizunashi , et al. August 7, 2	2018-08-07
Addition curable organopolysiloxane composition, and semiconductor package Grant 9,859,474 - Kusunoki , et al. January 2, 2	2018-01-02
Addition-curable Silicone Resin Composition And A Semiconductor Device App 20170174841 - IGUCHI; Hiroyuki ; et al.	2017-06-22
Adhesion Promoter, Addition Curable Organopolysiloxane Resin Composition And Semiconductor Apparatus App 20170121504 - MIZUNASHI; Tomoyuki ; et al.	2017-05-04
Addition Curable Organopolysiloxane Composition, And Semiconductor Package App 20170051114 - KUSUNOKI; Takayuki ; et al.	2017-02-23
Rivet, riveted joint structure riveting apparatus, and riveting method Grant 6,988,862 - Iguchi , et al. January 24, 2	2006-01-24
Self-piercing rivet App 20040068854 - Kato, Toru ; et al.	2004-04-15
Single flare tube and joint structure of single flare tube Grant 6,663,146 - Sakai , et al. December 16, 2	2003-12-16
Plant growth regulant Grant 4,902,815 - Motegi , et al. February 20, 1	1990-02-20
Benzamide derivative, process for its production and plant growth regulant Grant 4,878,942 - Motegi , et al. November 7, 1	1989-11-07

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