Igner; Eva

Patent Applications and Registrations

Patent applications and USPTO patent grants for Igner; Eva.The latest application filed is for "curable ink and a method for printing and curing the curable ink".

Company Profile

0.9.10

Igner; Eva - Haifa N/A IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for improving coating Grant 9,603,261 - Iraqi , et al. March 21, 2	2017-03-21
Curable Ink And A Method For Printing And Curing The Curable Ink App 20160278216 - Iraqi; Muhammad ; et al.	2016-09-22
Curable Ink And A Method For Printing And Curing The Curable Ink App 20140055544 - Iraqi; Muhammad ; et al.	2014-02-27
Method For Enhancing Metallization In Selective Deposition Processes App 20120196039 - Iraqi; Muhammad ; et al.	2012-08-02
Ultra Violet Light Emitting Diode Curing Of Uv Reactive Ink App 20120194622 - Iraqi; Muhammad ; et al.	2012-08-02
Method For Improving Coating App 20120177814 - Iraqi; Muhammad ; et al.	2012-07-12
System For Digital Deposition Of Pad / Interconnects Coatings App 20120171356 - Iraqi; Muhammad ; et al.	2012-07-05
Advanced multilayer coreless support structures and method for their fabrication Grant 7,682,972 - Hurwitz , et al. March 23, 2	2010-03-23
Coreless cavity substrates for chip packaging and their fabrication Grant 7,669,320 - Hurwitz , et al. March 2, 2	2010-03-02
Integrated circuit support structures and their fabrication Grant 7,635,641 - Hurwitz , et al. December 22, 2	2009-12-22
Coreless Cavity Substrates For Chip Packaging And Their Fabrication App 20070289127 - HURWITZ; Dror ; et al.	2007-12-20
Advanced Multilayered Coreless Support Structures and their Fabrication App 20070281471 - Hurwitz; Dror ; et al.	2007-12-06
Novel integrated circuit support structures and their fabrication App 20070082501 - Hurwitz; Dror ; et al.	2007-04-12
Process for manufacturing a chip carrier substrate Grant 6,280,640 - Hurwitz , et al. August 28, 2	2001-08-28
Chip carrier substrate Grant 6,262,376 - Hurwitz , et al. July 17, 2	2001-07-17
Electronic interconnect structure and method for manufacturing it Grant 6,262,478 - Hurwitz , et al. July 17, 2	2001-07-17
Method for manufacturing an electronic structure Grant 5,946,600 - Hurwitz , et al. August 31, 1	1999-08-31

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.