loadpatents
name:-0.004770040512085
name:-0.0005490779876709
name:-0.0012879371643066
Igawa; Seiichi Patent Filings

Igawa; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Igawa; Seiichi.The latest application filed is for "deposition apparatus and deposition method".

Company Profile
0.0.2
  • Igawa; Seiichi - Fuchu-shi JP
  • Igawa; Seiichi - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Deposition Apparatus And Deposition Method
App 20100055348 - TAKEYAMA; Terushige ;   et al.
2010-03-04
Plasma Treatment Apparatus
App 20090114154 - Nakagawara; Hitoshi ;   et al.
2009-05-07

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