IGARASHI; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for IGARASHI; Kouji.The latest application filed is for "adhesive film and method for manufacturing electronic device".

Company Profile

3.5.9

IGARASHI; Kouji - Chiyoda-ku Tokyo
Igarashi; Kouji - Duesseldorf DE
Igarashi; Kouji - Tokai JP
IGARASHI; Kouji - Tokai-shi Aichi
IGARASHI; Kouji - Nagoya-shi Aichi
Igarashi; Kouji - Nagoya JP
Igarashi, Kouji - Nagoya-shi Aichi JP
Igarashi; Kouji - Chofu JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive Film And Method For Manufacturing Electronic Device App 20220213349 - MIURA; Toru ; et al.	2022-07-07
Adhesive film having adhesive resin layers and method of manufacturing electronic apparatus using the adhesive film Grant 11,034,864 - Igarashi , et al. June 15, 2	2021-06-15
Adhesive Film And Method For Manufacturing Electronic Device App 20210122946 - IGARASHI; Kouji ; et al.	2021-04-29
Method For Manufacturing Electronic Device App 20210020461 - IGARASHI; Kouji ; et al.	2021-01-21
Adhesive Film And Method Of Manufacturing Electronic Apparatus App 20200048501 - IGARASHI; Kouji ; et al.	2020-02-13
Semiconductor wafer surface protection film and method for manufacturing semiconductor device Grant 10,340,172 - Kamada , et al.	2019-07-02
Semiconductor Wafer Surface Protection Film And Method For Manufacturing Semiconductor Device App 20180197764 - KAMADA; Jun ; et al.	2018-07-12
Adhesive film and method for manufacturing semiconductor device Grant 9,822,284 - Usugi , et al. November 21, 2	2017-11-21
Adhesive Film And Method For Manufacturing Semiconductor Device App 20160208144 - USUGI; Shinichi ; et al.	2016-07-21
Method Of Peeling Electronic Member And Laminate App 20160141197 - USUGI; Shinichi ; et al.	2016-05-19
Adhesive film and method for forming metal film using same App 20070167003 - Saimoto; Yoshihisa ; et al.	2007-07-19
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film Grant 7,238,421 - Saimoto , et al. July 3, 2	2007-07-03
Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film App 20050161774 - Saimoto, Yoshihisa ; et al.	2005-07-28
Method of assisting player in entering commands in video game, video game system, video game storage medium, and method of controlling video game Grant 5,807,174 - Fukuhara , et al. September 15, 1	1998-09-15

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