Igarashi; Katsutoshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Igarashi; Katsutoshi.The latest application filed is for "radiation sensitive resin composition and material for forming bumps containing the same".
- Igarashi; Katsutoshi - Yokohama JP
- Igarashi; Katsutoshi - Chuo JP
| Patent | Date |
|---|---|
| Radiation sensitive resin composition and material for forming bumps containing the same Grant 5,965,328 - Sano , et al. October 12, 1 | 1999-10-12 |
| Liquid curable urethane (meth)acrylate containing resin composition Grant 5,787,218 - Ohtaka , et al. July 28, 1 | 1998-07-28 |
| Composition for optical fiber coating comprising a polyether diol, a polyisocyanate, and a methacrylate Grant 4,992,524 - Coady , et al. February 12, 1 | 1991-02-12 |
| Curing apparatus Grant 4,591,724 - Fuse , et al. May 27, 1 | 1986-05-27 |
| Method for chain-opening polymerization of norbornene derivatives Grant 4,250,063 - Kotani , et al. February 10, 1 | 1981-02-10 |
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